LOW-DIELECTRIC-CONSTANT THERMALLY-CONDUCTIVE HEAT DISSIPATION MEMBER

Title:

LOW-DIELECTRIC-CONSTANT THERMALLY-CONDUCTIVE HEAT DISSIPATION MEMBER

Document Type and Number:

WIPO Patent Application WO/2019/031458

Kind Code:

A1

Abstract:

Provided is a heat dissipation member which has excellent thermal conductivity and dielectric properties, and which is particularly preferable as a heat dissipation member for an electronic component. This heat dissipation member is in the form of a sheet having a thickness of 0.1-0.5 mm, and includes a resin composition which contains 60-70 vol% of a thermally-conductive filler containing an aggregated powder of hexagonal boron nitride having an average particle size of 10-20 μm and an orientation index, as defined herein, of 2-20, and an aluminum oxide powder having an average particle size of 3-7 μm, and 30-40 vol% of a silicone resin. The orientation index is the ratio (I002/I100) of the intensity I002 of diffracted beams of the (002) plane to the intensity I100 of diffracted beams of the (100) plane in powder X-ray diffractometry.

Inventors:

YAMAGATA TOSHITAKA (JP)
WADA KOSUKE (JP)
KANEKO MASAHIDE (JP)

Application Number:

PCT/JP2018/029456

Publication Date:

February 14, 2019

Filing Date:

August 06, 2018

Export Citation:

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Assignee:

DENKA COMPANY LTD (JP)

International Classes:

H01L23/36; B32B17/04; B32B27/00; B32B27/20; C08J5/18; C08K3/22; C08K3/28; C08L83/04; H01L23/373

Foreign References:

JP2011144234A	2011-07-28
JPH1126661A	1999-01-29
JPH1160216A	1999-03-02
JP2003060134A	2003-02-28
JP2008293911A	2008-12-04
JP2009024126A	2009-02-05
JPH09202663A	1997-08-05
JPH1126661A	1999-01-29
JP2011144234A	2011-07-28

Other References: