Title:
LOW-DISSOLUTION ALUMINUM ALLOY MATERIAL FOR COOLING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2007/125762
Kind Code:
A1
Abstract:
A low-dissolution aluminum alloy material for cooling systems which is lightweight and excellent in thermal conductivity, processability, and castability and in which the alloying elements are inhibited as much as possible from dissolving away in a cooling liquid such as pure water. When it is used as a constituent member of a cooling system for, e.g., a fuel cell, there is no need of imparting anticorrosive properties to the cooling liquid itself or coating the inner surface of the cooling-system-constituting member for rust prevention. The low-dissolution aluminum alloy material for cooling systems contains either manganese (Mn) in an amount of 0.5-2.0 mass% in terms of Al4Mn and/or Al6Mn compound amount or silicon (Si) in an amount of 0.5-20 mass% in terms of silicon element amount. It may contain other alloying elements in such amounts that the total dissolution coefficient does not exceed 1.1.
Inventors:
TAGUCHI YOSHIHIRO (JP)
EBIHARA KEN (JP)
EBIHARA KEN (JP)
Application Number:
PCT/JP2007/058149
Publication Date:
November 08, 2007
Filing Date:
April 13, 2007
Export Citation:
Assignee:
NIPPON LIGHT METAL CO (JP)
TAGUCHI YOSHIHIRO (JP)
EBIHARA KEN (JP)
TAGUCHI YOSHIHIRO (JP)
EBIHARA KEN (JP)
International Classes:
C22C21/00
Foreign References:
| JP2004225160A | 2004-08-12 | |||
| JPS5935311A | 1984-02-27 | |||
| JP2003027167A | 2003-01-29 | |||
| JP2004002985A | 2004-01-08 | |||
| JP2006183126A | 2006-07-13 | |||
| JP2007016308A | 2007-01-25 |
Attorney, Agent or Firm:
SASAKI, Kazuya et al. (TKK Nishishinbashi Bldg.11-5, Nishi-shinbashi 2-chom, Minato-ku Tokyo 03, JP)
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