Title:
LOW FLUIDITY ENCAPSULANT FILM
Document Type and Number:
WIPO Patent Application WO/2020/011105
Kind Code:
A1
Abstract:
Disclosed in the present invention is a low fluidity encapsulant film, obtained by evenly mixing 100 parts by weight of base material having a melt index of 0.2-9 g/10 min, 0.1-5 parts by weight of peroxide-based crosslinking agent, 0.1-5 parts by weight of auxiliary crosslinking agent, 0.1-3 parts by weight of tackifying agent, 0-5 parts by weight of hindered amine light stabiliser, 0-2 parts by weight of ultraviolet light absorbing agent, and 0-40 parts by weight of pigment, adding same to an extruder, and extruding into a film by means of a T-shaped flat mould. The encapsulant film can reduce the risk of a cell of a photovoltaic module shifting during a laminating process, and prevent the layer of pigment-containing encapsulant film on the back of the module from covering the front surface of the cell during high-temperature lamination as a result of good fluidity. Due to the use of a thermal pre-crosslinking method, the acid content of the encapsulant film is significantly reduced compared to using a radiation crosslinking method, and there is less corrosion of the solder strips, bus bar, and cells of the module, so that the high power generation performance of the photovoltaic module can be maintained for longer.
Inventors:
PENG RUIQUN (CN)
MU DANHUA (CN)
HOU HONGBING (CN)
XIONG XI (CN)
ZHOU GUANGDA (CN)
LIN JIANHUA (CN)
SANG YAN (CN)
MU DANHUA (CN)
HOU HONGBING (CN)
XIONG XI (CN)
ZHOU GUANGDA (CN)
LIN JIANHUA (CN)
SANG YAN (CN)
Application Number:
PCT/CN2019/094773
Publication Date:
January 16, 2020
Filing Date:
July 05, 2019
Export Citation:
Assignee:
HANGZHOU FIRST APPLIED MAT CO LTD (CN)
International Classes:
C09J7/10; C08L23/06; C08L23/08; C09J4/02; C09J4/06; C09J7/30; C09J11/04; C09J11/06; C09J123/06; C09J123/08; H01L31/048
Foreign References:
| CN103804774A | 2014-05-21 | |||
| CN104130725A | 2014-11-05 | |||
| CN102533163A | 2012-07-04 |
Attorney, Agent or Firm:
HANGZHOU QIUSHI PATENT OFFICE CO.,LTD. (CN)
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