Title:
LOW-ROUGHNESS SURFACE-TREATED COPPER FOIL WITH LOW BENDING DEFORMATION, COPPER CLAD LAMINATE COMPRISING SAME, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/191402
Kind Code:
A1
Abstract:
The present invention relates to a surface-treated copper foil, which has excellent adhesive strength with a resin substrate, shows low bending deformation after adhesion with a resin substrate, and is suitable as a high-frequency foil due to its low transmission loss, to a copper clad laminate comprising same, and to a printed wiring board. The present invention provides a surface-treated copper foil comprising a surface-treated layer formed on at least one surface of an original copper foil and an anti-oxidation layer formed on the surface-treated layer, wherein at least one surface of the surface-treated copper foil comprises fine copper particles having an average particle diameter of 100 nm or less and the surface-treated copper foil has a deformation value (Y) of 5 or smaller as expressed by the following equation: Deformation value (Y) = Tensile strength deformation value (Y1) + Elongation deformation value (Y2) (where, Y1 = (T1-T2)/(kgf/mm2); Y2 = (E2-E1)/%; T2 and E2 represent tensile strength and elongation, respectively, as measured after heat treatment at a pressure of 4.9 Mpa and a temperature of 220°C for 90 minutes; and T1 and E1 represent tensile strength and elongation, respectively, as measured at room temperature).
Inventors:
YANG CHANG YOL (KR)
SEO JUNG WOO (KR)
SONG KIDEOK (KR)
LEE SUNHYOUNG (KR)
SEO JUNG WOO (KR)
SONG KIDEOK (KR)
LEE SUNHYOUNG (KR)
Application Number:
PCT/KR2022/000439
Publication Date:
September 15, 2022
Filing Date:
January 11, 2022
Export Citation:
Assignee:
ILJIN MAT CO LTD (KR)
International Classes:
H05K3/38; B32B15/08; B32B15/20; H05K1/09
Domestic Patent References:
| WO2010110092A1 | 2010-09-30 |
Foreign References:
| JP2016149438A | 2016-08-18 | |||
| KR20130132111A | 2013-12-04 | |||
| KR20190135878A | 2019-12-09 | |||
| US20090136725A1 | 2009-05-28 | |||
| US6194056B1 | 2001-02-27 |
Attorney, Agent or Firm:
HMP IP GROUP (KR)
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