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Title:
LOW-SOLVENT RESIN COMPOSITION, LOW-SOLVENT COATING COMPOSITION, AND METHOD OF COATING THEREWITH
Document Type and Number:
WIPO Patent Application WO/1994/021737
Kind Code:
A1
Abstract:
A low-solvent resin composition comprising an oligomer having an alicyclic epoxy group in the molecule, a number-average molecular weight of 300 to 2,000, a weight-average molecular weight of 300 to 4,000 and a ratio of the weight-average molecular weight to the number-average molecular weight of 1 to 2.5; and a low-solvent coating composition comprising the above low-solvent resin composition as a binder and a cationic polymerization catalyst and having an organic solvent content of 0 to 40 % by weight. The amount of the organic solvent used can be remarkably reduced, since the coating composition comprising the low-molecular oligomer has a low viscosity, though its solid content is high. The resultant coating film is excellent in appearance and resistances to water, chipping, alkali, weather, scuff, gasoline, etc.

Inventors:
MARUTANI YOSHIAKI (JP)
NAKAHAMA TADAMITSU (JP)
SASAKI SHINJI (JP)
UEMURA HIROYUKI (JP)
KOGA KAZUHI (JP)
TOMITA TAKASHI (JP)
OHSAWA MIKA (JP)
Application Number:
PCT/JP1994/000456
Publication Date:
September 29, 1994
Filing Date:
March 22, 1994
Export Citation:
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Assignee:
MAZDA MOTOR (JP)
MARUTANI YOSHIAKI (JP)
NAKAHAMA TADAMITSU (JP)
SASAKI SHINJI (JP)
UEMURA HIROYUKI (JP)
KOGA KAZUHI (JP)
TOMITA TAKASHI (JP)
OHSAWA MIKA (JP)
International Classes:
B05D1/00; C09D133/06; (IPC1-7): C09D163/00
Foreign References:
JPH02228320A1990-09-11
JPH02233717A1990-09-17
JPH02289611A1990-11-29
JPH02180921A1990-07-13
JPH01123817A1989-05-16
JPH0457819A1992-02-25
JPH0457820A1992-02-25
JPH04325579A1992-11-13
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