Title:
LOW-TEMPERATURE-SINTERING CERAMIC MATERIAL, CERAMIC SINTERED BODY, AND CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/185921
Kind Code:
A1
Abstract:
Provided are a low-temperature-sintering ceramic material capable of achieving low permittivity and high strength, and a ceramic sintered body obtained by sintering the material. The low-temperature-sintering ceramic material or ceramic sintered body contains 65-80 parts by weight of Si in terms of SiO2, 5-25 parts by weight of Ba in terms of BaO, 1-10 parts by weight of Al in terms of Al2O3, 0.1-5 parts by weight of Mn in terms of MnO, 0.1-5 parts by weight of B in terms of B2O3, and not less than 0.1 parts by weight but less than 3 parts by weight of Li in terms of Li2O. This ceramic sintered body is advantageously used in a ceramic electronic component, such as, for example, a multilayer circuit board (1) or a coupler.
Inventors:
SUGIMOTO YASUTAKA (JP)
KANEKO KAZUHIRO (JP)
KANEKO KAZUHIRO (JP)
Application Number:
PCT/JP2016/063709
Publication Date:
November 24, 2016
Filing Date:
May 09, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
C04B35/195; H01B3/02; H01B3/12; H05K1/03; H05K3/46
Foreign References:
| JPS62226855A | 1987-10-05 | |||
| JPS62182157A | 1987-08-10 | |||
| JP2006001755A | 2006-01-05 | |||
| JP2000211969A | 2000-08-02 | |||
| JP2004203646A | 2004-07-22 |
Attorney, Agent or Firm:
KOSHIBA, MASAAKI (JP)
小柴 雅昭 (JP)
小柴 雅昭 (JP)
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