METHOD FOR ANCHORING Sn POWDER ON ALUMINIUM SUBSTRATE AND ALUMINIUM ELECRTOCONDUCTIVE MEMBER

WIPO Patent Application WO/2013/141250

A1

Provided are a method for anchoring Sn powder, and an aluminium electroconductive member manufactured using the method, in which an Sn film layer having excellent adhesion and heat-cycle properties is adhesively deposited on the surface of an aluminium substrate using a high-productivity cold-spray method entailing minimal device expenditure. A method for forming an Sn film layer in which an Sn powder is deposited on and anchored to the surface of an aluminium substrate using a cold-spray method, wherein the Sn powder is sprayed onto the aluminium substrate to anchor the Sn powder to the aluminium substrate under an operating gas temperature of 60°C or below and an operating gas pressure of 0.30 MPa or greater. A spray gap of 5-30 mm is present between the spray-gun nozzle and the aluminium substrate.

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YOSHIDA RYO (JP)
HORI HISASHI (JP)
NISHIKAWA YOSUKE (JP)
YOSHIMOTO SAYURI (JP)

PCT/JP2013/057861

September 26, 2013

March 19, 2013

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NIPPON LIGHT METAL CO (JP)

C23C24/04

JP2009191345A	2009-08-27
JP2009074145A	2009-04-09
JP2007270893A	2007-10-18

SASAKI Kazuya et al. (JP)
Kazuya Sasaki (JP)

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