Title:
MACHINE TEMPERATURE CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/066206
Kind Code:
A1
Abstract:
This disclosure provides a machine temperature control device that uses a plurality of thermosiphon circuits with which the number of parts can be reduced and the efficiency of mounting on a vehicle and flexibility in mounting on the vehicle can be improved. A first thermosiphon circuit (10) has: a first evaporator (11) that cools a first subject machine (BP1) by the latent heat of vaporization of a working fluid that is evaporated by absorbing heat from the first subject machine (BP1); and a first passage (12) that communicates with the first evaporator (11). A second thermosiphon circuit (20) has: a second evaporator (21) that cools a second subject machine (BP2) by the latent heat of vaporization of a working fluid that is evaporated by absorbing heat from the second subject machine (BP2); and a second passage (22) that communicates with the second evaporator (21). A main condenser (40) has a first heat exchanging unit (120) provided in the first passage (12) and a second heat exchanging unit (220) provided in the second passage (22), and is configured so that heat exchange is performed among working fluid flowing in the first heat exchanging unit (120), working fluid flowing in the second heat exchanging unit (220), and a prescribed cold heat supplying medium.
Inventors:
OMI YASUMITSU (JP)
YOSHINORI TAKESHI (JP)
TAKEUCHI MASAYUKI (JP)
MIURA KOJI (JP)
YOSHINORI TAKESHI (JP)
TAKEUCHI MASAYUKI (JP)
MIURA KOJI (JP)
Application Number:
PCT/JP2017/026349
Publication Date:
April 12, 2018
Filing Date:
July 20, 2017
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
F28D15/02; H01L23/427; H05K7/20
Foreign References:
| JP2014047962A | 2014-03-17 | |||
| US20070234741A1 | 2007-10-11 | |||
| JP2012118781A | 2012-06-21 | |||
| JP2004363308A | 2004-12-24 | |||
| JP2006012874A | 2006-01-12 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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