Title:
MACHINING DEVICE, MACHINING METHOD, AND COMPUTER STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2020/003995
Kind Code:
A1
Abstract:
This machining device for machining a substrate includes: a plurality of rotary holding units for holding and rotating a substrate; a plurality of conveyance units for conveying the substrate; a plurality of processing units for consecutively processing the substrate; and a control unit for respectively grouping and controlling the plurality of rotary holding units, the plurality of conveyance units, and the plurality of processing units. The control unit: respectively manages states of the rotary holding units, states of the conveyance units, and states of the processing units; controls holding of the substrate at the plurality of rotary holding units in accordance with the states of the rotary holding units; controls conveyance of the substrate at the plurality of conveyance units in accordance with the states of the conveyance units; and controls processing of the substrate at the plurality of processing units in accordance with the states of the processing units.
Inventors:
KANEKO TOMOHIRO (JP)
HARA YOSHITAKA (JP)
HARA YOSHITAKA (JP)
Application Number:
PCT/JP2019/022959
Publication Date:
January 02, 2020
Filing Date:
June 10, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; B24B41/06
Foreign References:
| JP5473736B2 | 2014-04-16 | |||
| JP2013254964A | 2013-12-19 | |||
| JP2015065478A | 2015-04-09 | |||
| JP2012199328A | 2012-10-18 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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