Title:
MACHINING DEVICE AND MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/192332
Kind Code:
A1
Abstract:
A machining device 10 machines a machining object 251 comprising a plurality of layers. The machining device 10 is provided with: a machining unit 200; a storage device 190 that stores a machining method generation format and machining conditions; and a control unit 100 that controls the machining unit 200. The machining unit 200 is provided with machining mechanism sections 220 that machine the machining object 251, and a machining section state information collection mechanism section 230 that acquires machining section state information of the machining object 251 before/after machining. The control unit 100 generates a machining method on the basis of the machining section state information before machining, the machining conditions stored in the storage device, and the machining method generation format, and generates machining instruction information for the machining unit 200 on the basis of the machining method.
Inventors:
NAKASU NOBUAKI (JP)
KOSAKA JUNYA (JP)
SUGIZAKI MIKIO (JP)
KOSAKA JUNYA (JP)
SUGIZAKI MIKIO (JP)
Application Number:
PCT/JP2020/026453
Publication Date:
September 30, 2021
Filing Date:
July 06, 2020
Export Citation:
Assignee:
HITACHI HIGH TECH FINE SYSTEMS CORP (JP)
International Classes:
B23Q39/00; B23Q17/00; G05B19/4093
Domestic Patent References:
| WO2009028056A1 | 2009-03-05 |
Foreign References:
| JP2002189510A | 2002-07-05 | |||
| JP2011510831A | 2011-04-07 | |||
| JP2015000434A | 2015-01-05 | |||
| JP2008009661A | 2008-01-17 | |||
| JP2019093451A | 2019-06-20 |
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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