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Title:
MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/058107
Kind Code:
A1
Abstract:
A machining device (1, 201) for machining a workpiece (W), which is supported by a workpiece supporting member (20, 30, 40, 60, 220, 230, 240), with a tool (T, T2), the machining device (1, 201) comprising a processing unit (3, 203) that controls machining, or estimates at least one of the state of the workpiece (W) or the tool (T, T2) during machining, the shape of the workpiece (W), the shape of the tool (T, T2), and a machine state of the machining device (1, 201), using contact dynamic stiffness data (Cwc, Kwc) between the workpiece (W) and the workpiece supporting member (20, 30, 40, 60, 220, 230, 240) provided by the contact between the workpiece (W) and the workpiece supporting member (20, 30, 40, 60, 220, 230, 240).

Inventors:
KOBAYASHI HISANOBU (JP)
MORI TOMOYA (JP)
KUHARA JUNJI (JP)
Application Number:
PCT/JP2021/036792
Publication Date:
April 13, 2023
Filing Date:
October 05, 2021
Export Citation:
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Assignee:
JTEKT CORP (JP)
International Classes:
B24B49/16; B23Q15/12; B23Q17/09
Foreign References:
JP2009064426A2009-03-26
JPH01234135A1989-09-19
JP2015208812A2015-11-24
Attorney, Agent or Firm:
AICHI, TAKAHASHI, IWAKURA & ASSOCIATES (JP)
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