Title:
MACHINING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/032053
Kind Code:
A1
Abstract:
This machining system includes: a mounting apparatus on which a workpiece and a reference member are mounted; a machining apparatus capable of performing irradiation of a machining beam via an objective optical system; a light detection apparatus capable of irradiating the reference member with a measurement beam via the objective optical system and capable of receiving light from the reference member; a machining head including the objective optical system; a rotation apparatus that rotates the mounting apparatus; and a calculation unit. The light detection apparatus acquires a first detection result by irradiation of the measurement beam to the reference member located at a first position, and acquires a second result by irradiation of the measurement beam to the reference member having moved to a second position. The calculation unit calculates a movement error generated in movement of at least one of the mounting apparatus and the machining head on the basis of positional information of the reference member obtained from the first and second detection results.
Inventors:
MATSUDA TAKESHI (JP)
Application Number:
PCT/JP2021/032010
Publication Date:
March 09, 2023
Filing Date:
August 31, 2021
Export Citation:
Assignee:
NIKON CORP (JP)
International Classes:
G01B11/00; B23K26/00; B23K26/02; B23K26/08; B23K26/082
Domestic Patent References:
| WO2000054925A1 | 2000-09-21 |
Foreign References:
| JP2011038902A | 2011-02-24 | |||
| JPH07236989A | 1995-09-12 | |||
| JPH07260423A | 1995-10-13 | |||
| JP2013101114A | 2013-05-23 | |||
| JPH1058174A | 1998-03-03 | |||
| JP2015051493A | 2015-03-19 |
Attorney, Agent or Firm:
EGAMI, Tatsuo (JP)
Download PDF: