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Title:
MAGNETIC PASTE
Document Type and Number:
WIPO Patent Application WO/2020/105704
Kind Code:
A1
Abstract:
Provided are the following: a magnetic paste which has a suitable viscosity and in which resin sagging is suppressed; a circuit board and an inductor part obtained using the magnetic paste; and a method for producing the magnetic paste. The magnetic paste contains (A) a magnetic powder having an average particle diameter of 1 μm or more, (B) an epoxy resin, (C) a reactive diluent, (D) a curing agent and (E) a filler having an average particle diameter of less than 1 μm.

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Inventors:
TANAKA TAKAYUKI (JP)
OOYAMA HIDEKI (JP)
Application Number:
PCT/JP2019/045632
Publication Date:
May 28, 2020
Filing Date:
November 21, 2019
Export Citation:
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Assignee:
AJINOMOTO KK (JP)
International Classes:
B22F1/10; B22F1/103; B22F9/00; H01F1/28; H01F1/37; H01F17/04; B22F1/05; H05K1/16
Domestic Patent References:
WO2007119426A12007-10-25
WO2018194100A12018-10-25
Foreign References:
JP2009044068A2009-02-26
JP2007207928A2007-08-16
JP2016060682A2016-04-25
JP2016197624A2016-11-24
Other References:
See also references of EP 3885062A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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