Title:
MAGNETRON PLASMA DEPOSITION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/196307
Kind Code:
A1
Abstract:
A magnetron sputtering deposition apparatus 1 is provided with a deposition roller 14 and a magnetron plasma unit 15 that is disposed so as to face the deposition roller 14. The magnetron plasma unit 15 is provided with: a rotary target 16 having an axial line that extends in the same direction as the axial line of the deposition roller 14; and a magnet unit 200 which is disposed radially inward of the rotary target 16. Angle θ as determined below is not more than 30 degrees. On an outer circumferential surface of the rotary target 16, a tangential-direction component of the magnetic flux density of the rotary target 16 is measured in one circumferential direction of the rotary target 16. The angle θ is formed by a line segment LS1 connecting the center of the rotary target 16 and a point MAX_P corresponding to a maximum tangential-direction component of the magnetic flux density and a line segment LS2 connecting said center and a point MIN_P corresponding to a minimum tangential-direction component of the magnetic flux density.
Inventors:
MORICHI KENTA (JP)
TOMOGUCHI NAOKI (JP)
TANIGUCHI TSUYOSHI (JP)
TOMOGUCHI NAOKI (JP)
TANIGUCHI TSUYOSHI (JP)
Application Number:
PCT/JP2020/012408
Publication Date:
October 01, 2020
Filing Date:
March 19, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C23C14/35
Foreign References:
| US20170345628A1 | 2017-11-30 | |||
| JP2014500398A | 2014-01-09 | |||
| JP2014534341A | 2014-12-18 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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