Title:
MAGNETRON SPUTTERING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/011509
Kind Code:
A1
Abstract:
Disclosed in the present application is a magnetron sputtering apparatus, comprising: a process chamber; a target material arranged at the top in the process chamber; a carrying base for carrying a wafer, the carrying base being arranged in the process chamber and located below the target material; and a guide device arranged between the target material and the carrying base, the guide device being configured to form an electric or magnetic field in the process chamber, and the electric or magnetic field being configured to adjust a movement trajectory of particles sputtered by the target material, such that the particles tend to be vertically deposited on the wafer. The above solution can optimize the quality of deposition of the particles sputtered by the target material.
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Inventors:
LAN YUE (CN)
Application Number:
PCT/CN2022/109895
Publication Date:
February 09, 2023
Filing Date:
August 03, 2022
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
C23C14/35
Foreign References:
| JP2016117923A | 2016-06-30 | |||
| US20110048927A1 | 2011-03-03 | |||
| CN1265222A | 2000-08-30 | |||
| US20150170698A1 | 2015-06-18 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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