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Title:
MALEIMIDE RESIN, CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2017/170551
Kind Code:
A1
Abstract:
Provided are: a maleimide resin which contains a small amount of a ring-unclosed amic acid; and a cured product which is obtained by curing a curable resin composition using this maleimide resin, and which has excellent thermal decomposability, excellent flame retardancy, excellently low moisture absorbency and excellent strength. This maleimide resin is represented by formula (1), and has an acid value of 5 mgKOH/g or less. (In the formula, X represents an aromatic hydrocarbon group having 6-18 carbon atoms; each one of a plurality of R1 moieties independently represents a hydrogen atom, an alkyl group having 1-10 carbon atoms or an aromatic group; m represents an integer of 1-4; and n represents a real number of 1-10.)

Inventors:
KUBOKI KENICHI (JP)
NAKANISHI MASATAKA (JP)
MATSUURA KAZUKI (JP)
Application Number:
PCT/JP2017/012642
Publication Date:
October 05, 2017
Filing Date:
March 28, 2017
Export Citation:
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Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G61/02; C08F22/40
Domestic Patent References:
WO2015152007A12015-10-08
Foreign References:
JPH0761969A1995-03-07
JPH05140097A1993-06-08
JPH05140095A1993-06-08
JP2009001783A2009-01-08
JPH01294662A1989-11-28
JP2016023195A2016-02-08
JPH0348659A1991-03-01
JPH0356463A1991-03-12
JPH05221974A1993-08-31
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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