MALEIMIDE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF

WIPO Patent Application WO/2020/054601

A1

Provided is a maleimide resin with superior solution stability. Also provided is a cured product with a superior dielectric characteristic that is obtained by curing a curable resin composition in which said maleimide resin is used. The maleimide resin expressed in formula (1), wherein the N,N'-(phenylene-di-(2,2,-propylidene)-di-p-phenylene)bismaleimide content is 90area% or less. (In formula (1), n is the number of repetitions, and 1