Title:
MALEIMIDE RESIN MOLD, METHOD FOR MANUFACTURING MALEIMIDE RESIN MOLD, MALEIMIDE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/043380
Kind Code:
A1
Abstract:
Provided are a maleimide resin mold, a maleimide resin composition, and a cured product thereof with less environmental exposure which have excellent workability and production efficiency, for example, in highly reliable semiconductor sealing material applications, electric and electronic part insulating material applications, various composite material applications including laminates (printed wiring glass fiber reinforced composite material) and carbon fiber reinforced composite material (CFRP), various adhesive applications, various coating applications, and structural members. The maleimide resin mold includes a maleimide resin and an organic solvent, and is film-shaped or flake-shaped.
More Like This:
Inventors:
TOHJIMA TAKAYUKI (JP)
NAKANISHI MASATAKA (JP)
MATSUURA KAZUKI (JP)
NAKANISHI MASATAKA (JP)
MATSUURA KAZUKI (JP)
Application Number:
PCT/JP2017/030694
Publication Date:
March 08, 2018
Filing Date:
August 28, 2017
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F22/40; C08G73/00
Domestic Patent References:
| WO2005100457A1 | 2005-10-27 |
Foreign References:
| JP2006348298A | 2006-12-28 | |||
| JP2008287226A | 2008-11-27 | |||
| JP2011082559A | 2011-04-21 | |||
| JP2002328232A | 2002-11-15 | |||
| JP2002331574A | 2002-11-19 | |||
| JP2004189828A | 2004-07-08 | |||
| JP2004231857A | 2004-08-19 | |||
| JP2017071738A | 2017-04-13 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
Download PDF: