Title:
MANAGEMENT DEVICE, MANAGEMENT METHOD, AND WAFER MANUFACTURING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/024178
Kind Code:
A1
Abstract:
This management device 20 comprises a control unit 22 that manages a plurality of wafer processing devices 1. The control unit 22 selects a wafer processing device 1 to be assigned to processing of a prescribed type of wafer from among the plurality of wafer processing devices 1, on the basis of the distance between post-processing characteristics of wafers processed by each wafer processing device 1 and the center value of a standard of the prescribed type of wafer .
Inventors:
MIYAZAKI YUJI (JP)
Application Number:
PCT/JP2023/014282
Publication Date:
February 01, 2024
Filing Date:
April 06, 2023
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B24B1/00; B24B37/013; B24B37/08; G05B19/418; H01L21/02
Domestic Patent References:
| WO2017122340A1 | 2017-07-20 |
Foreign References:
| JPH11267952A | 1999-10-05 | |||
| JP2017045143A | 2017-03-02 | |||
| US20150248127A1 | 2015-09-03 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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