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Patent Searching and Data


Title:
MANIFOLD FLUID MODULE
Document Type and Number:
WIPO Patent Application WO/2023/229278
Kind Code:
A1
Abstract:
The present invention relates to a manifold fluid module. The manifold fluid module according to one embodiment of the present invention comprises: a manifold plate in which a fluid flow path is formed; a first heat exchanger which is coupled to the manifold plate, and which induces heat exchange between a first fluid and a second fluid; a second heat exchanger which is coupled to the manifold plate, and which induces heat exchange between the second fluid and the first fluid discharged from the first heat exchanger; and a plurality of valves for controlling whether the first fluid flowing into the first heat exchanger or the second heat exchanger has expanded, or controlling the direction of the first fluid, wherein the plurality of valves can be arranged to be accumulated on the manifold plate.

Inventors:
LEE HAE JUN (KR)
HWANG IN GUK (KR)
RHEE SANG YONG (KR)
LEE SUNG JE (KR)
Application Number:
PCT/KR2023/006590
Publication Date:
November 30, 2023
Filing Date:
May 16, 2023
Export Citation:
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Assignee:
HANON SYSTEMS (KR)
International Classes:
B60H1/32; B60H1/00
Foreign References:
CN113276630A2021-08-20
CN216033602U2022-03-15
US20130283838A12013-10-31
KR20210022220A2021-03-03
KR20200031907A2020-03-25
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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