MANUFACTURING DEVICE OF PACKAGE AND MANUFACTURING METHOD OF PACKAGE

WIPO Patent Application WO/2020/066274

A1

Provided is a manufacturing device, etc., of a package for which the quality of a sealed state can be inspected more accurately. A sealed portion 6 is formed by heat-welding stacked sheets 3 in a state where a prescribed workpiece is packaged with the sheets 3 made of resin. The heat-welding is performed so that the thickness of the sealed portion 6 is smaller than the combined thickness of the stacked sheets to be heat-welded before the heat-welding. In the inspection of the sealed portion 6, thickness information corresponding to the thickness of the sealed portion 6 is acquired, and the quality of the sealed state in the sealed portion 6 is determined on the basis of the acquired thickness information. In order to perform heat-welding so that the thickness of the sealed portion 6 and the quality of the sealed state are correlated, quality determination is performed on the basis of the thickness information, and thus, the quality of the sealed state can be determined more accurately.

JP7060868	Packaging equipment
JPS5842252	[Title of the device] A detection apparatus of non-Aligned coin of a coin packaging machine

TAGUCHI YUKIHIRO (JP)

PCT/JP2019/029698

April 02, 2020

July 29, 2019

Click for automatic bibliography generation  

CKD CORP (JP)

B65B57/00; G01N21/90; B65B57/02; G01B11/06; G01N21/958

WO2016088713A1

2016-06-09

JPH02297007A	1990-12-07
JPH06345062A	1994-12-20
JP2002236004A	2002-08-23
JPS62277512A	1987-12-02
KR20100006386U	2010-06-24
JPH05612U	1993-01-08
JPH09207921A	1997-08-12
JP2016176813A	2016-10-06
US20060048486A1	2006-03-09
JPS62276444A	1987-12-01

See also references of EP 3859319A4

KAWAGUCHI Mitsuo (JP)

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