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Patent Searching and Data


Title:
MANUFACTURING METHOD OF CUT FILM, CUT FILM, AND FILM FOR CUT FILM
Document Type and Number:
WIPO Patent Application WO/2020/039970
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a cut film, comprising cutting an uncut cut film including a resin layer with a laser beam having a wavelength of 400-850 nm, to obtain a cut film. The uncut cut film has absorbance in the wavelength of the laser beam of equal to or lower than 0.10.

Inventors:
YAMADA SATOSHI (JP)
Application Number:
PCT/JP2019/031464
Publication Date:
February 27, 2020
Filing Date:
August 08, 2019
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Assignee:
ZEON CORP (JP)
International Classes:
B23K26/38; B23K26/40; G02B5/30
Foreign References:
JP2016057403A2016-04-21
JP2018052082A2018-04-05
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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