Title:
MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2010/140576
Kind Code:
A1
Abstract:
Disclosed is a manufacturing method for an electronic component, in which some of external electrodes are positioned on the main surfaces of a dielectric block, and which is capable of forming the sections of the external electrodes that are positioned on the main surfaces of the dielectric block with high precision.
By detecting the light irradiated from a second main surface side with a detector (24) arranged on a first main surface side, the positions of first and second internal electrodes (11, 12) are detected, and by forming a conductive layer (33) in the section on the first main surface that has been determined on the basis of the result of the detection, first sections (13a, 14a) of first and second external electrodes (13, 14) are formed, respectively.
Inventors:
TSUTSUMI HIRONORI (JP)
Application Number:
PCT/JP2010/059233
Publication Date:
December 09, 2010
Filing Date:
June 01, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
TSUTSUMI HIRONORI (JP)
TSUTSUMI HIRONORI (JP)
International Classes:
H01G13/00; H01G4/12; H01G4/30
Foreign References:
| JP2007273728A | 2007-10-18 | |||
| JP2000021680A | 2000-01-21 |
Attorney, Agent or Firm:
MIYAZAKI, Chikara et al. (JP)
Miyazaki Chikara (JP)
Miyazaki Chikara (JP)
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