Title:
MANUFACTURING METHOD FOR LAMINATED BOARD AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2013/136729
Kind Code:
A1
Abstract:
Provided is a laminated board that is provided with an insulating layer and copper foil positioned on at least one surface of the insulating layer, and that is used in a device mounting substrate obtained by forming a conductor circuit by etching the copper foil. The copper foil etching rate is between 0.68µm/min and 1.25µm/min under conditions where the laminated board it immersed in a sulfuric acid/hydrogen peroxide etching liquid comprising 55.9g/L of sulfuric acid and 19.6cc/L of 34.5% hydrogen peroxide and at a temperature of 30°C+1°C.
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| JPH01287989 | MANUFACTURE OF PRINTED WIRING BOARD |
| JPS63275194 | FORMATION OF METALLIC PATTERN |
Inventors:
ITO TEPPEI (JP)
OHIGASHI NORIYUKI (JP)
OHIGASHI NORIYUKI (JP)
Application Number:
PCT/JP2013/001432
Publication Date:
September 19, 2013
Filing Date:
March 07, 2013
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
NIPPON DENKAI LTD (JP)
NIPPON DENKAI LTD (JP)
International Classes:
H05K3/06; C25D1/04; H05K1/09
Domestic Patent References:
| WO2009101948A1 | 2009-08-20 |
Foreign References:
| JP2000188460A | 2000-07-04 | |||
| JP2005005341A | 2005-01-06 | |||
| JPH11172467A | 1999-06-29 | |||
| JPH10330983A | 1998-12-15 | |||
| JP2007294923A | 2007-11-08 | |||
| JP2008294432A | 2008-12-04 |
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
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