Title:
MANUFACTURING METHOD FOR LEAD FRAME, AND LEAD FRAME STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/083360
Kind Code:
A1
Abstract:
Embodiments of the present invention disclose a manufacturing method for a lead frame, comprising: arranging a first anti-plating layer on the surface of a frame substrate, and exposing and developing the first anti-plating layer to obtain first grooves; filling the first grooves by means of an electroplating, chemical deposition or sputtering addition method to obtain first bosses; arranging a second anti-plating layer on the first bosses and the first anti-plating layer, and exposing and developing the second anti-plating layer to obtain second grooves, wherein each second groove is located in the upper portion of each first boss, and a part of the second groove is located at the upper portion of the first anti-plating layer; filling the second groove by means of the electroplating, chemical deposition or sputtering addition method to form a cap structure on the first boss; and removing the first anti-plating layer and the second anti-plating layer. The cap structure, the first boss, and the frame substrate form an I-shaped structure, and thus, the bonding surface of the lead frame and a plastic packaging body can be increased, the stress between the lead frame and the plastic packaging body is reduced, the bonding force between the lead frame and the plastic packaging body is enhanced, and the probability of layering and cracking is reduced.
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Inventors:
SHAO DONGDONG (CN)
Application Number:
PCT/CN2022/131778
Publication Date:
May 19, 2023
Filing Date:
November 14, 2022
Export Citation:
Assignee:
SHENZHEN SIPTORY TECH CO LTD (CN)
International Classes:
H01L21/48; H01L23/495
Foreign References:
| CN113782453A | 2021-12-10 | |||
| CN113113319A | 2021-07-13 | |||
| CN201838582U | 2011-05-18 | |||
| CN108551725A | 2018-09-18 | |||
| US20020024147A1 | 2002-02-28 | |||
| CN112133640A | 2020-12-25 |
Attorney, Agent or Firm:
SHENZHEN YIZHI IP AGENCY FIRM (CN)
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