Title:
MANUFACTURING METHOD FOR METAL-FILLED MICROSTRUCTURE AND INSULATING BASE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/065095
Kind Code:
A1
Abstract:
Provided is a manufacturing method for a metal-filled microstructure for through-holes and an insulating base material that control against a through-hole being insufficiently metal-filled and hollow spaces forming when multiple through-holes are being filled with metal. The manufacturing method for the metal-filled microstructure, wherein multiple through-holes penetrating in the thickness direction of the insulating base material are filled with metal, has a metal-filling process for filling the multiple through-holes with the metal. During the metal-filling process, the insulating base material with the multiple through-holes is immersed for more than five seconds in a plating solution containing metal ions without any voltage applied thereto, and by subsequently increasing the current value continuously or over multiple stages, the multiple through-holes are filled with the metal through electrolytic plating.
Inventors:
KOMATSU HIROSHI (JP)
TONOHARA KOJI (JP)
KASUYA YUICHI (JP)
HOTTA YOSHINORI (JP)
TONOHARA KOJI (JP)
KASUYA YUICHI (JP)
HOTTA YOSHINORI (JP)
Application Number:
PCT/JP2018/032556
Publication Date:
April 04, 2019
Filing Date:
September 03, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C25D21/12; C25D11/20
Foreign References:
| JP2006328476A | 2006-12-07 | |||
| JPS58177488A | 1983-10-18 | |||
| JP2013040395A | 2013-02-28 | |||
| JP2012015479A | 2012-01-19 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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