Title:
MANUFACTURING METHOD OF PURE COPPER PLATES, AND PURE COPPER PLATE
Document Type and Number:
WIPO Patent Application WO/2011/078188
Kind Code:
A1
Abstract:
Disclosed is a simple method for manufacturing pure copper plates which does not involve cold forging or cold pressing after hot forging or hot pressing, or heat processing thereafter; also disclosed is the finely uniform pure copper plate which is obtained by said method, has low residual stress and excellent processability, and is especially suitable as a copper sputtering target material. Pure copper ingots of purity no less than 99.96 wt% are heated to 550-800°C, and after hot pressing with a total press rates of 85% or more and a temperature at press completion of 500-700°C, are quenched at a cooling rate of 200-1000°C/min until the temperature reaches 200°C or less from the aforementioned temperature at press completion.
Inventors:
SAKAI TOSHIHIRO (JP)
TAKEDA TAKAHIRO (JP)
KITA KOICHI (JP)
MAKI KAZUNARI (JP)
MORI HIROYUKI (JP)
TAKEDA TAKAHIRO (JP)
KITA KOICHI (JP)
MAKI KAZUNARI (JP)
MORI HIROYUKI (JP)
Application Number:
PCT/JP2010/073045
Publication Date:
June 30, 2011
Filing Date:
December 21, 2010
Export Citation:
Assignee:
MITSUBISHI SHINDO KK (JP)
MITSUBISHI MATERIALS CORP (JP)
SAKAI TOSHIHIRO (JP)
TAKEDA TAKAHIRO (JP)
KITA KOICHI (JP)
MAKI KAZUNARI (JP)
MORI HIROYUKI (JP)
MITSUBISHI MATERIALS CORP (JP)
SAKAI TOSHIHIRO (JP)
TAKEDA TAKAHIRO (JP)
KITA KOICHI (JP)
MAKI KAZUNARI (JP)
MORI HIROYUKI (JP)
International Classes:
C22F1/08; B21B1/38; B21B3/00; C23C14/34; C22F1/00
Foreign References:
| JPH11158614A | 1999-06-15 | |||
| JP2005533187A | 2005-11-04 | |||
| JP2002220659A | 2002-08-09 | |||
| JP2001240949A | 2001-09-04 | |||
| JPS62112763A | 1987-05-23 |
Attorney, Agent or Firm:
AOYAMA, MASAKAZU (JP)
Aoyama Masakazu (JP)
Aoyama Masakazu (JP)
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