MANUFACTURING METHOD FOR SUBSTRATE WITH METAL PATTERN

WIPO Patent Application WO/2019/131290

A1

Provided is a manufacturing method for a substrate with a metal pattern, by which damage to a fluororesin layer is suppressed and a metal pattern can be formed on the surface of the fluororesin layer with good patterning characteristics. Specifically provided is a manufacturing method for a substrate with a metal pattern comprising a substrate 1, a fluororesin layer 3, and a metal pattern 5, wherein a composition including a fluororesin having an amide group and a solvent is applied to the substrate 1 and is dried to form the fluororesin layer 3; a pattern formation area set in a portion of the surface of the fluororesin layer 3 is irradiated with an actinic ray; and a metal-particle-dispersed liquid, in which metal particles are dispersed in a dispersion solvent, is applied to the surface of the fluororesin layer 3, and is dried.

JP3430348	METAL-CERAMIC LAMINATED SUBSTRATE
JP3382482	[Title of Invention] A method for manufacturing a circuit board for a semiconductor package.
JP2011171453	METHOD OF FORMING DRAWING PATTERN AND ELECTRONIC DEVICE

NAKAYAMA FUMIKO (JP)

PCT/JP2018/046414

July 04, 2019

December 17, 2018

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AGC INC (JP)

H05K3/10; B05D1/36; B05D3/06; B05D7/24; H01B13/00; H05K3/38; H01B1/22; H01B5/14

WO2006129800A1	2006-12-07
WO2016136817A1	2016-09-01

SENMYO Kenji et al. (JP)

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