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Title:
MASK FOR FILM PACKAGING OF OLED
Document Type and Number:
WIPO Patent Application WO/2019/033559
Kind Code:
A1
Abstract:
A mask for film packaging of an organic light-emitting diode (OLED), comprising a hollowed-out part, the hollowed out part comprising perforations (105) used to form a film packaging layer (103); and a cover part (102), which is used to cover a non-film packaging area on a substrate (101), wherein the surface where the cover part (102) and the substrate (101) make contact is a first surface and the surface of the cover part (102) away from the substrate (101) is a second surface. The cover part (102) that is positioned surrounding the perforations (105) has an edge that is at least partially chamfered on the side that contacts the substrate (101).

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Inventors:
YU WEI (CN)
Application Number:
PCT/CN2017/107992
Publication Date:
February 21, 2019
Filing Date:
October 27, 2017
Export Citation:
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Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L51/52; H01L51/56
Foreign References:
US20160336542A12016-11-17
CN106784368A2017-05-31
CN104674162A2015-06-03
CN102629671A2012-08-08
JP2012119338A2012-06-21
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
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