[0001] Embodiments of the present disclosure relate to an edge exclusion mask, particularly a mask frame support element or an edge support frame (ESF) and a mask frame element or a mask frame. The edge exclusion mask can be provided for a support table of a deposition apparatus. Embodiments of the present disclosure also relate to a mask frame support element, an edge exclusion mask configured for masking a substrate edge of a substrate supported on a table, a mask frame element, a substrate support, a substrate processing apparatus, and a method of manufacturing one or more devices on a large area substrate. BACKGROUND

[0002] Several methods are known for the deposition of a material on a substrate. For example, a substrate may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process. A substrate on which material is deposited, i.e. a substrate to be coated, is introduced into a vacuum chamber of a vacuum processing system and is positioned relative to a processing area of the vacuum chamber of the vacuum processing system. For example, a coating process can take place in the vacuum chamber.

[0003] Coating processes, i.e. material deposition processes, may be considered for large area substrates, e.g. in display manufacturing technology. Coated substrates can be used further in several technical fields with applications e.g. in microelectronics, in the production of semiconductor devices, for substrates with thin film transistors, but also for insulating panels, etc. The tendency towards larger substrates, e.g. in manufacturing larger displays results in larger vacuum processing systems.

[0004] In a coating process, substrates may be held on a substrate support. The substrate is secured by a mask frame support and an edge of the substrate is masked by a mask frame. The mask frame delimits the area of the substrate to be processed. Further, shadowing effects of the mask frame may occur close to a mask edge.

[0005] In light of the above, it is beneficial to provide an improved masking, particularly to increase the processing efficiency of a substrate.

SUMMARY

[0006] According to an embodiment, a mask frame support element for a mask frame support is provided. The mask frame support element includes along a first direction, which is configured to extend along a side edge of a substrate, a protruding section configured to provide a contact to the substrate and a recessed section configured to couple a portion of a mask frame to the mask frame support.

[0007] According to an embodiment, an edge exclusion mask configured for masking a substrate edge of a substrate supported on a table is provided. The edge exclusion mask includes a mask frame configured to provide a masking edge and a mask frame support having a plurality of mask frame support elements configured to provide contact to the substrate. One or more of the plurality of mask frame support elements are a mask frame support element according to any of the embodiments of the present disclosure.

[0008] According to an embodiment, a mask frame element is provided. The mask frame element includes a body having a mask edge extending along a first direction configured to extend along a side edge of a substrate. The body has a protrusion extending downwardly and providing the mask edge. The protrusion includes a first section having a first width extending from the mask edge away from the mask edge and a second section having a second width larger than the first width, the second width extending from the mask edge away from the mask edge. [0009] According to an embodiment, a substrate support is provided. The substrate support includes a table body, a table frame coupled to the table body, and an edge exclusion mask according to any of the embodiments of the present disclosure and provided at least partially at the table frame.

[0010] According to an embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes vacuum chamber and a substrate support according to any of the embodiments described herein and provided within the vacuum chamber.

[0011] According to an embodiment, a method of manufacturing one or more devices on a substrate is provided. The method includes loading a substrate on a table body of a substrate support table to be supported by the table body, contacting the substrate with one or more mask frame support elements by protruding sections while not contacting the substrate with recessed sections of the one or more mask frame support elements, and processing the substrate while being contacted.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following.

[0013] FIG. 1 shows a schematic top view of an edge exclusion mask according to embodiments of the present disclosure;

[0014] FIG. 2 shows a schematic sectional view of an edge exclusion mask as previously known;

[0015] FIGS. 3A and 3B show schematic sectional views of an edge exclusion mask according to embodiments of the present disclosure; [0016] FIG. 4 shows a schematic view of a mask frame support element according to embodiments of the present disclosure;

[0017] FIG. 5 shows a schematic view of a mask frame element according to embodiments of the present disclosure;

[0018] FIGS. 6 A and 6B show schematic sectional views of an edge exclusion mask according to embodiments of the present disclosure;

[0019] FIG. 7 shows a schematic sectional view of a mask frame support element and a mask frame element according to embodiments of the present disclosure;

[0020] FIG. 8 shows a schematic view of a mask frame element according to embodiments of the present disclosure;

[0021] FIG. 9 shows a schematic view of a substrate support according to embodiments of the present disclosure;

[0022] FIG. 10A shows a schematic view of a substrate processing apparatus according to embodiments of the present disclosure;

[0023] FIG. 10B shows a schematic view of a substrate processing apparatus according to embodiments of the present disclosure; and

[0024] FIG. 11 shows a flow chart illustrating one or more methods of manufacturing one or more devices on a large area substrate according to embodiments of the present disclosure.

DETAILED DESCRIPTION OF EMBODIMENTS

[0025] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in each figure. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with any other embodiment to yield yet a further embodiment. It is intended that the present disclosure includes such modifications and variations. Within the following description of the drawings, the same reference numbers refer to the same or to similar components. Generally, only the differences with respect to the individual embodiments are described. Unless specified otherwise, the description of a part or aspect in one embodiment can apply to a corresponding part or aspect in another embodiment as well.

[0026] Deposition systems can include a substrate support, often including a substrate support table having e.g. a table body and a table frame coupled to the table body. The table frame can be reversibly coupled to an edge support frame (ESF). The ESF can support a mask, such as a mask for edge exclusion. A substrate can be positioned between the table body and the edge support frame or the mask.

[0027] For processing, a substrate is typically arranged between the table frame and the ESF. The ESF or the edge exclusion mask is coupled to the table frame for processing of the substrate. Coupling the ESF or the edge exclusion mask is coupled to the table frame holds the mask and the substrate in place for processing. The edge exclusion mask masks an edge portion of the substrate, for example, a couple of millimeters or a few millimeters at the edge of the substrate. Considering a large area substrate for display manufacturing a few millimeters at the rectangular perimeter of the substrate having 1 m ² or more, such as 4 m ² or more is excluded from processing, such as deposition, by the edge exclusion mask.

[0028] The processing can involve tilting the substrate support for coating. After processing, the ESF is separated from the table frame and the coated substrate is exchanged. During processing, the substrate temperature and the temperature of the edge exclusion mask can be elevated, e.g. by heating or by energy provided by the substrate processing. For example, the temperature can be 100°C or above, such as 150°C or above.

[0029] FIG. 1 shows an edge exclusion mask 100. The edge exclusion mask includes a mask frame and a mask frame support. The mask frame includes mask frame elements, which are shown in the top view of FIG. 1. The mask frame support includes mask frame support elements. As shown in FIG. 1, the mask frame elements include mask frame side elements 102 and mask frame corner elements 103. [0030] The mask frame shown in FIG. 1 provides a rectangular aperture and masks an edge of a substrate 50, i.e. in FIG. 1 a rectangular substrate. As can be appreciated by a person skilled in the art, other shapes of substrates and corresponding shapes of mask frame or an edge exclusion mask, respectively, can be provided. For example, the substrate and the aperture can be round, elliptical, another polygon shape, or the like. A direction as referred to herein may also be considered as a direction of a polar coordinate system or a cylindrical coordinate system respectively for non- polygon-shaped substrate shapes.

[0031] The substrate 50, for example for a rectangular substrate, includes a first side edge 54a, a second side edge 54b, the third side edge 54c, and a fourth side edge 54d. The first side edge and the third side edge are opposing each other and/or are parallel to each other. The second side edge and the fourth side edge are opposing each other and/or are parallel to each other. In FIG. 1, the first side edge and the third side edge extend along the Y-direction and the second side edge and the fourth side edge extend along the X-direction. Accordingly, for embodiments described herein, a direction extending along a side edge of a substrate or being configured to extend along the side edge of a substrate is considered, with respect to the figures, to be the Y-direction for the first and third side edge of the substrate and to be the X-direction for the second and the fourth side edge of the substrate. In FIGS. 2 to 8, portions of an edge exclusion mask, a mask frame support element, and/or a mask frame element corresponding to the third side edge 54c in FIG. 1 are shown. As described above, it can be appreciated by a person skilled in the art that the X-direction and the Y- direction may need to be exchanged when referring to the second side edge or the fourth side edge instead of the third side edge. With reference to FIGS. 2 to 8, reference to a side edge or a mask edge is made in general, i.e. without referring to the third side edge or the like.

[0032] As shown in FIG. 1, the edge exclusion mask or the mask frame, respectively, have mask edges corresponding to the side edges of the substrate. FIG. 1 shows a first mask edge 104a, a second mask edge 104b, a third mask edge 104c, and a fourth mask edge 104d. For other substrate shapes, one or more mask edges corresponding to the substrate edges, i.e. the side edges of the substrate, can be provided. According to some embodiments, which can be combined with other embodiments described herein, the shape of the mask edges or the aperture provided by the mask frame and the shape of the substrate are similar in a geometrical sense.

[0033] FIG. 2 shows a schematic sectional view of an edge exclusion mask 10, which has previously been used. FIG. 2 shows a portion of a mask frame support, i.e. a portion of an edge support frame, ESF, or a mask frame support element 22. A mask frame element 24 is coupled and/or attached to the mask frame support element. The mask edge 14 and the side edge of the substrate 50 extend along the Y-direction. An edge region 21 is masked by the edge exclusion mask. The mask frame support element is configured to provide a contact to the substrate. The substrate is held and fixed by the contact of the mask frame support element.

[0034] As indicated by arrows 52 and 53 in FIG. 1, the substrate can show size and shape tolerances. Further, thermal expansion may occur differently for the edge exclusion mask and the shape resulting in further deviations of the side edge position of a substrate and a corresponding mask edge position. Considering tolerances of about 2 mm to 8mm on each side of the substrate, the edge region 21 typically has a minimum size of several millimeters to ensure that the ESF contacts the substrate during processing in order to avoid a failure in substrate support, which may result in glass breakage or the like. The 2mm to 8mm tolerances will help to mask the substrate. Because of the masking the processing material will not coat on the other materials, such as the edge on table (EOT), i.e. the edge exclusion mask or the susceptor plate, i.e. the substrate support table.

[0035] Embodiments of the present disclosure allow for a reduced size of the edge region, which is excluded from processing, for example, material deposition. The overlap of the edge exclusion mask with the substrate can be reduced. The substrate wastage can be reduced and the substrate usage can be increased. For example, an area for deposition, such as sputter deposition, can be increased.

[0036] According to an embodiment, a mask frame support element is provided. The mask frame support element includes, particularly alternatingly, along a first direction configured to extend along the side edge of the substrate protruding sections configured to provide a contact to the substrate, and recessed sections configured to couple a portion of a mask frame to the mask frame support. For example, with respect to FIGS. 3 A to 8, the first direction is the Y-direction. The protruding section and the recessed section are protruding or recessed, respectively, in an X-direction. In a Y- direction, a first protruding section is adjacent to a first recessed section, a second recessed section is adjacent to the first protruding section, a second protruding section is adjacent to the second recessed section, and so forth.

[0037] A zigzag glass protective stripe or a zigzag mask frame support element, i.e. having protruding sections and recessed sections, can be provided for an edge exclusion mask, e.g. for holding a substrate on a substrate support table. The edge exclusion mask may also be referred to as an “edge on table” (EOT). Due to the zigzag design, the edge exclusion mask may also be strengthened. According to some embodiments, a zigzag contact of the mask frame support with the substrate is provided, as compared to a straight-line contact of the common mask frame shown in FIG. 2. Due to the zigzag design, the mask edge can be shorter and/or the edge region 21 having an overlap of the edge exclusion mask with the substrate can be smaller.

[0038] According to some embodiments, which can be combined with other embodiments described herein, a connection between a mask frame support element and a mask frame element can be provided by the protrusion engaging with a cavity. This is exemplarily illustrated in FIGS. 3A to 5. Additionally or alternatively, the connection can be provided by a dovetail connection. This is exemplarily illustrated in FIGS. 6 A to 8.

[0039] FIGS. 3A and 3B show schematic sectional views of an edge exclusion mask 100 according to embodiments of the present disclosure. The same views are shown for a portion of an edge exclusion mask and/or mask frame support elements and mask frame elements, respectively. FIG. 3 A shows a sectional view at a first position along the Y-direction, for example, along a first direction configured to extend along a side edge of a substrate. FIG. 3B shows a sectional view at a second position along the Y-direction, for example, along a first direction configured to extend along a side edge of a substrate. The mask frame support element 302 has a protruding section 312 in FIG. 3 A. The mask frame support element 302 has a recessed section in FIG. 3B. The protruding section 312 is configured to be in contact with the substrate 50. The recessed section is configured to couple the mask frame element 304 to the mask frame support element 302.

[0040] The mask frame element 304 includes a body having a mask edge 104. The mask edge extends along the first direction, i.e. along the Y-direction in FIGS. 3A and 3B. The first direction extends along the side edge of the substrate 50 and/or parallel to the side edge 54 of the substrate 50. The mask edge, for example, a straight mask edge, is provided in the first section shown in FIG. 3A and in a second section shown in FIG. 3B. The mask edge is provided by a protrusion extending downwardly. A first width 322 is provided in the first section. The first width extends from the mask edge and away from the mask edge. A second width 324 is provided in the second section. The second width is larger than the first width. The second width extends from the mask edge and away from the mask edge. The first width and the second width can be a width of the protrusion extending downwardly from the body of the mask frame element or an upper portion of the mask frame element, respectively.

[0041] The first section of the mask frame element 304 corresponds to the protruding section of the mask frame support element 302. The second section of the mask frame element 304 corresponds to the recessed section of the mask frame support element 302. The difference of the first width 322 relative to the second width 324 corresponds to a width difference between the protruding section and the recessed section. According to some embodiments, which can be combined with other embodiments described herein, a width difference between the protruding section of the mask frame support element and the recessed section of the mask frame support element can be 1 mm or above. Correspondingly, a difference in width of the protrusion of the mask frame element between the first width and the second width can be 1 mm or above.

[0042] As shown by the dashed line 315 in FIG. 3B, the recessed section of the mask frame support element 302 is sloping downwardly and away from the protruding section. A tip is formed in an upper portion of the mask frame support element 302 at a position of the recessed section. An undercut is formed in a lower portion of the mask frame support element 302 at a position of the recessed section. [0043] As shown by the dashed line 315 in FIG. 3B, the second section of the mask frame element forms a cavity 334. A tip is formed in a lower portion of the mask frame element 304 at a position of the second section. An undercut or cavity is formed in an upper portion of the mask frame element 304 at a position of the second section. The cavity or undercut is configured to have the mask frame element to engage with and/or to attach to the mask frame support element. The tip of the mask frame support element and the cavity of the mask frame support element correspond to each other to provide a coupling between the mask frame element and the mask frame support element. According to some embodiments, which can be combined with other embodiments described herein, the mask frame element is attached to or engaged with the mask frame support element to minimize or avoid the vertical movement, i.e. a movement away from or towards the substrate, of the mask frame element and the mask frame support element relative to each other. According to some embodiments, which can be combined with other embodiments described herein, the recessed section of the mask frame support element is configured to receive a cavity of the mask frame element to attach the mask frame element to the mask frame support element. According to some embodiments, which can be combined with other embodiments described herein, the recessed section of the mask frame support element and the second section of the mask frame element, provide a positive locking connection.

[0044] FIG. 4 is a schematic view of the mask frame support element or a portion of an ESF, respectively. The protruding section 312 and recessed section 314 of the mask frame support element 302 form a zigzag structure along the Y-direction. The recessed section 314 is sloping downwardly and away from the mask edge as indicated by the dashed line 315 to allow for a connection between a mask frame element in the mask frame support element.

[0045] The zigzag structure allows for sufficient contact of the edge exclusion mask with the substrate, particularly in the protruding sections, to provide a reliable contact to the substrate even upon occurrence of substrate shape and/or substrate size tolerances and even upon occurrence of thermal expansion. The zigzag structure further allows to securely couple a mask frame element to a mask frame support element, particularly in the recessed sections. The second width 324 is sufficiently large to allow for coupling of the mask frame element in the mask frame support element. The masking in general allows for thermal expansion while masking edges of the substrate from coating because for some applications it is beneficial not to coat material on the full glass.

[0046] FIG. 5 shows a schematic view of a mask frame element 304. The mask frame element 304 has a mask edge, particularly a straight mask edge, to provide an edge exclusion mask for a substrate. The cavity 334 is formed in the second section of the mask frame element. The cavity or undercut allows for attaching the mask frame element 304 to a mask frame support element.

[0047] As described above, a recessed section of a mask frame support element and a second section of the mask frame element can provide a positive locking connection. FIGS. 6A, 6B, 7 and 8 show a further example, wherein a connection between a mask frame element and the mask frame support element is provided by the dovetail joint.

[0048] FIGS. 6 A and 6B show schematic sectional views of an edge exclusion mask 100 according to embodiments of the present disclosure. The same views are shown for a portion of an edge exclusion mask and/or mask frame support elements and mask frame elements, respectively. FIG. 6A shows a sectional view at a first position along the Y-direction, for example, along a first direction configured to extend along a side edge of a substrate. FIG. 6B shows a sectional view at a second position along the Y-direction, for example, along a first direction configured to extend along a side edge of a substrate. The mask frame support element 302 has a protruding section 312 in FIG. 6 A. The mask frame support element 302 has a recessed section 314 in FIG. 6B. The protruding section 312 is configured to be in contact with the substrate 50. The recessed section is configured to couple the mask frame element 304 to the mask frame support element 302 with a dovetail connection.

[0049] The mask frame element 304 includes a body having a mask edge 104. The mask edge extends along the first direction, i.e. along the Y-direction in FIGS. 6A and 6B. The first direction extends along the side edge of the substrate 50 and/or parallel to the side edge 54 of the substrate 50. The mask edge, for example, a straight mask edge, is provided in the first section shown in FIG. 6A and in a second section shown in FIG. 6B. The mask edge is provided by a protrusion extending downwardly. A first width 322 is provided in the first section. The first width extends from the mask edge and away from the mask edge. A second width 324 is provided in the second section. The second width is larger than the first width. The second width extends from the mask edge and away from the mask edge. The first width and the second width can be a width of the protrusion extending downwardly from the body of the mask frame element or an upper portion of the mask frame element, respectively.

[0050] The first section of the mask frame element 304 corresponds to the protruding section of the mask frame support element 302. The second section of the mask frame element 304 corresponds to the recessed section of the mask frame support element 302. The difference of the first width 322 relative to the second width 324 corresponds to a width difference between the protruding section and the recessed section. The differences in widths can be provided similar to the embodiments described with respect to FIGS. 3 A and 3B.

[0051] According to some embodiments, which can be combined with other embodiments described herein, the mask frame element is attached to or engaged with the mask frame support element to minimize or avoid the vertical movement, i.e. a movement away from or towards the substrate, of the mask frame element and the mask frame support element relative to each other. According to some embodiments, which can be combined with other embodiments described herein, the recessed section of the mask frame support element and the second section of the mask frame element provide a positive locking connection by a dovetail joint. According to some embodiments, which can be combined with other embodiments described herein, the positive locking mechanism with a dovetail joint can be combined with other locking mechanisms described herein, for example, in different regions of an ESF or a mask frame.

[0052] FIG. 7 is a schematic view of the mask frame support element or a portion of an ESF, respectively, and a mask frame element or a mask frame respectively. The view is a sectional view parallel to a substrate edge or mask edge (in the Y-direction) to further illustrate the dovetail connection. The protruding sections and recessed sections 314 of the mask frame support element 302 form a zigzag structure along the Y-direction. [0053] The zigzag structure allows for sufficient contact of the edge exclusion mask with the substrate, particularly in the protruding sections, to provide a reliable contact to the substrate even upon occurrence of substrate shape and/or substrate size tolerances and even upon thermal expansion. The zigzag structure further allows to securely couple a mask frame element to a mask frame support element, particularly in the recessed sections. The second width 324 is sufficiently large to allow for coupling of the mask frame element in the mask frame support element.

[0054] FIG. 8 shows a schematic view of a mask frame element 304. The mask frame element 304 has a mask edge, particularly a straight mask edge, to provide an edge exclusion mask for a substrate. A dovetail- shaped connector 834 is formed in the second section of the mask frame element, particularly for attaching the mask frame element 304 to a mask frame support element.

[0055] According to some embodiments, which can be combined with other embodiments described herein, a mask frame support element can include PEEK, polyimide (e.g. Vespel), polybenzimidazole (e.g. Celazole) or combinations thereof. According to some embodiments, which can be combined with other embodiments described herein, the mask frame element can include aluminum, titanium or combinations thereof. Additionally or alternatively, the mask frame element can have a structured surface, particularly to reduce flaking off of deposition material adhering to the mask frame element.

[0056] Embodiments of the present disclosure provide the zigzag substrate protection stripe with a corresponding mask frame. The overlap of the edge exclusion mask and the substrate can be reduced by 1 mm or more, for example, about 2 mm. The overlap may be defined as a distance in a projection into the substrate plane between the substrate edge and the mask edge. Considering the dimensions of, for example, a GEN 8 substrate, the substrate area to be processed, for example by sputter deposition can be increased by about 185 cm ² . An efficiency of, for example, a sputter deposition source can be increased. The area of uniform material deposition can be increased by moving the mask edge closer to the substrate edge. Further, the zigzag structure of the mask support element can strengthen the structural design. [0057] Some embodiments, features, and details are described herein with respect to a mask frame element or a mask frame support element. The mask frame elements can be joined together to form a mask frame. The mask frame elements may also be referred to as mask frame portions, wherein the straight elements, such as mask frame side elements 102, and comer elements, such as mask frame corner elements 103 (see FIG. 1) are elements of a mask frame that can be joined together. The same applies to the mask frame support elements. The mask frame and optionally the mask frame support, i.e. the edge support frame (ESF), provide the edge exclusion mask. The embodiments, features and details described with respect to the mask frame elements and the mask frame support elements similarly apply to an edge exclusion mask.

[0058] According to one embodiment, an edge exclusion mask configured for masking a substrate edge of the substrate is provided. The substrate can be supported on the table. The edge exclusion mask includes a mask frame configured to provide a masking edge and a mask frame support having a plurality of mask frame support elements. The mask frame and/or the mask frame support elements are configured to provide a contact to the substrate. One or more of the plurality of mask frame support elements are provided according to embodiments described herein. Particularly, a zigzag design can be provided. One or more of the plurality of mask frame support elements include a protruding section and recessed section as described herein.

[0059] Referring to FIG. 9, a substrate support 900 according to some embodiments of the present disclosure is shown schematically. The substrate support 900 includes a table body and a table frame 940. The table body can be configured for supporting a substrate (not shown). According to another embodiment, which can be combined with other embodiments described herein, the fixtures can be provided to fix an ESF of an edge exclusion mask 100 to the table frame 940 and/or the table, i.e. a substrate support table.

[0060] As shown in FIG. 9, according to embodiments, the substrate support includes an ESF or an edge exclusion mask 100. In FIG. 9, the edge exclusion mask is shown in a coupled configuration with solid lines, i.e. in a configuration in which the substrate is supported on the substrate support table and fixed with an edge exclusion mask. [0061] According to embodiments, which can be combined with other embodiments described herein, the substrate support 900 can have a substrate (not shown) arranged between the table frame 940 and the edge exclusion mask 100 or an ESF of the edge exclusion mask. The substrate can be fixed between the table frame 940 and the ESF. The substrate can be fixed, e.g. clamped between the table frame and the ESF, by contact of the mask frame support or mask frame support element, respectively, with the substrate, particularly in a protruding section of a mask frame support element.

[0062] As shown in FIG. 9, according to embodiments, the substrate support 900 can include a tilt drive 920 for tilting a portion of the substrate support 900, particularly the portion including a substrate, e.g. the table body with table frame 940 and the edge exclusion mask in the coupled configuration. Tilting the portion of the substrate support can involve a tilt motion 924. The tilt motion can involve rotating, along a defined angular range, the portion of the substrate support around a common axis. Tilting of the substrate support can bring the portion of the substrate support from an essentially horizontal position into an essentially vertical position, such as the vertical position 926 shown in FIG. 9. The vertical position 926 can be used advantageously for particular phases of a substrate processing operation, such as a material deposition operation. The horizontal position can be used advantageously for other particular phases of a substrate processing operation, such as loading and/or unloading of the substrate. According to some embodiments, which can be combined with other embodiments described herein, an essentially vertical or essentially horizontal orientation may deviate from a vertical or horizontal orientation, respectfully, by +- 15°.

[0063] As shown in FIG. 9, according to embodiments, the substrate support 900 can include a lift pin assembly including substrate support pins 910 or lift pins and lift pin drive or actuator 912. The lift pin assembly can be configured for specifically lifting portions of the substrate support 900, particularly for lifting the edge exclusion mask along a direction of ESF motion 914. The direction of ESF motion 914 or edge exclusion mask motion can be perpendicular to the substrate surface. [0064] As shown in FIG. 9, according to embodiments, the action of the lift pin assembly can bring the substrate support 900 from a coupled state into an uncoupled state 916 by lifting the edge exclusion mask with respect to the table frame 940. According to embodiments, which can be combined with other embodiments described herein, the uncoupled state 916 can be utilized for particular phases of a substrate processing method, such as loading and/or unloading of the substrate.

[0065] According to embodiments, which can be combined with embodiments described herein, a substrate support as described herein, particularly a substrate support 900, can be configured to be operated inside a vacuum chamber, particularly a vacuum chamber of a deposition apparatus. The vacuum can be a constant vacuum, or the vacuum can be cycled, i.e. vary between a vacuum state and a pressurized state.

[0066] According to embodiments, a substrate support is provided. The substrate support includes a table body and a table frame coupled to the table body. An edge exclusion mask according to any of the embodiments of the present disclosure is provided at least partially at the table frame or over the table frame. The edge exclusion mask may be moved relative to the table frame, particularly for loading and/or unloading of a substrate.

[0067] FIG. 10A shows a schematic view of a substrate processing apparatus 1000 for material deposition on a substrate 50. A substrate is moved relative to a processing area 1310 inside a vacuum chamber 1100. FIG. 10A shows a material deposition source 1200. Particularly the material deposition source 1200 can be a sputter cathode of an array of cathodes, such as rotatable sputter cathodes. The processing area 1310 is provided in an area in front of the material deposition source 1200.

[0068] The sources may provide the ejected material as shown in FIG. 10A. The substrate processing apparatus 1000 for material deposition on a substrate 50 includes the vacuum chamber 1100. The substrate 50 can be supported by a substrate support 900 as shown in FIG. 9 and corresponding embodiments can be included in the substrate processing apparatus 1000. In some embodiments, a support body may include a support surface 1440. The support body is located inside the vacuum chamber 1100. According to embodiments of the present disclosure, the apparatus includes a tilt drive 920 coupled to the support surface 1440.

[0069] FIG. 10A shows the substrate 50 supported on the support surface 1440 of the support body. The substrate 50 is partially covered by an edge exclusion mask according to embodiments described herein.

[0070] Embodiments described herein particularly relate to deposition of materials, e.g. for display manufacturing on large area substrates. According to some embodiments, large area substrates or carriers supporting one or more substrates may have a size of at least 0.5 m ² For instance, the deposition system may be adapted for processing large area substrates, such as substrates of GEN 5, which corresponds to about 1.4 m ² substrates (1.1 m x 1.3 m), GEN 6, which corresponds to about 2.7 m ² (1.5 m x about 1.8 m), GEN 7.5, which corresponds to about 4.29 m ² substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m ² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m ² substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented. According to yet further implementations, half sizes of the above-mentioned substrate generations can be processed. Alternatively or additionally, semiconductor wafers may be processed and coated in deposition systems according to the present disclosure.

[0071] The apparatuses and systems described herein are configured in order to mask substrates that may in particular have a surface of 1 m ² or above. The term “substrate” may particularly embrace substrates like glass substrates for display manufacturing and may also embrace substrates like wafers, slices of transparent crystal such as sapphire or the like. However, the term “substrate” may embrace other substrates that can be inflexible or flexible, like e.g. a foil or a web. The substrate may be formed by any material suitable for material deposition.

[0072] Embodiments described herein can relate to components of a deposition system in which substrates, which can be substrates as described above, are loaded and unloaded in a horizontal configuration and in which the substrates are processed, e.g. coated, in a vertical configuration. A deposition system according to some embodiments described herein are suitable for use in a deposition apparatus in which a substrate is supported in different configurations, particularly in a deposition apparatus including a tilt drive for moving a substrate between a horizontal and a vertical configuration.

[0073] A vacuum processing apparatus or vacuum deposition apparatus as described in FIG. 10A and also in FIG. 10B can be provided in a cluster system, in which one or more vacuum processing apparatuses are coupled to a central transfer chamber, particularly a central vacuum transfer chamber.

[0074] FIG. 10B shows a vacuum processing apparatus or substrate processing apparatus 1000, for example, a vacuum deposition apparatus. The deposition apparatus includes a vacuum chamber. The vacuum chamber 1100 as exemplarily shown in FIG. 10B includes segments, such as a source frame segment. The source frame segment is configured to support the source assembly and/or a source support assembly, respectively. As shown in FIG. 10B, a plurality of sputter cathodes, i.e. material deposition sources 1200, and a plurality of anodes 1202 are provided in the source frame segment. Alternatively, one or more other sources may be provided and/or supported by a source support assembly.

[0075] A substrate handling segment is provided below the source frame segment.

The substrate handling segment includes or houses components for substrate handling, substrate alignment, substrate masking, substrate support, or the like. The substrate handling segment may have an upper portion and a lower portion, wherein the lower portion may include a bottom lid assembly. FIG. 10B shows the substrate support table and an actuator 912 coupled to the substrate support body. The actuator can be a linear actuator or drive configured to move the substrate support body vertically. For example, FIG. 10B shows the substrate support body in a first position below the upper ends of the substrate support pins 910. The actuator may move the support body, to a second position, i.e. an upper position, wherein the substrate support body is positioned above the upper ends of the substrate support pins 910. In the second position, the substrate can be masked by the edge exclusion mask 100. The edge exclusion mask can be provided according to any of the embodiments described herein. [0076] The substrate 50 disposed on the substrate support pins 910 will be contacted by the substrate support body upon movement of the substrate support body from the first position to the second position. Accordingly, the substrate can be disposed on the substrate support body for material deposition by lifting the substrate support body from the first position to the second position.

[0077] According to some embodiments of the present disclosure, which can be combined with other embodiments described herein, a substrate support can be a support table, e.g. a substrate support table, or a pedestal, e.g. a substrate support pedestal provided in a processing chamber of a vacuum processing system. A support table may particularly be configured for horizontal substrate processing or essentially horizontal substrate processing. For example, the processing chamber including the substrate support may be provided in a cluster system. When loading the substrate onto the substrate support, the substrate may be provided onto an electrostatic chuck until electrostatic forces are established. Some embodiments of the present disclosure provide a substrate support with an electrostatic chuck.

[0078] According to an embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes a vacuum chamber and a substrate support according to any of the embodiments described herein, which is provided within the vacuum chamber. Particularly, an edge exclusion mask according to embodiments of the present disclosure having one or more mask frame support elements described herein and/or one or more mask frame elements as described herein are provided. The vacuum chamber can include a port 1110 for connecting a vacuum pump to the vacuum chamber.

[0079] Referring to FIG. 11, a flow chart illustrating a method 11 of manufacturing one or more devices on a substrate is shown. The substrate may particularly be a large area substrate as described herein and/or a substrate for display manufacturing. The method includes in box 13 loading of a substrate on a table body of a substrate support table to be supported by the table body. The substrate may be loaded in a substrate processing apparatus as described with respect to FIGS. 10A and 10B and/or may be loaded on a substrate support as described with respect to FIG. 9. The method further includes in box 15 contacting of the substrate with one or more mask frame support elements by protruding sections while not contacting the substrate with recessed sections of the one or more mask frame support elements. This corresponds to the situations shown in FIGS. 3 A and 3B, as well as FIGS. 6A and 6B, respectively. Details of mask frame support elements described herein may be implemented for the described method. The method further includes processing the substrate while being contacted (see box 17). Processing of the substrate particularly includes material deposition on the substrate and more particularly, material deposition by sputtering, for example with rotatable sputter cathodes. The rotatable sputter cathodes may have cylindrical targets. For example, an array of sputter cathodes can be used for substrate processing.

[0080] A method may further include masking an edge of the substrate with a mask frame supported by the one or more mask frame support elements. For example, the mask frame can provide a straight mask edge along one or more of the protruding sections and one or more of the recessed sections. According to some embodiments, which can be combined with other embodiments described herein, the nominal width of the mask region, i.e. the width excluding glass size or glass shape tolerances and excluding thermal expansion can be 2.7 mm or smaller, particularly 2 mm or smaller, or even 1.5 mm or smaller. According to some embodiments, which can be combined with other embodiments described herein, a clamp area of 1.5 mm or smaller, e.g. of about 1mm is provided.

[0081] While the foregoing is directed to implementations of the present disclosure, other and further implementations of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.