Title:
MASKING JIG, FILM FORMATION METHOD, AND FILM FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/034222
Kind Code:
A1
Abstract:
A masking jig (1) is used in thermal spraying. The masking jig (1) comprises a body part (11). The body part (11) includes a first surface (11a) and a second surface (11b). The second surface (11b) is positioned on the reverse side from the first surface (11a). A through hole (12) is formed in the body part (11) reaching from the first surface (11a) to the second surface (11b). In the through hole (12), a first through hole (12a) formed so as to open the first surface (11a), and a second through hole (12b) formed so as to open the second surface (11b) run together. A second width (X2), which is the width in a direction along the first surface (11a) of the second through hole (12b), is greater than a first width (X1), which is the width in a direction along the first surface (11a) of the first through hole (12a). The body part (11) is formed by an imide resin.
Inventors:
HIRANO MASAKI (JP)
TANAKA SYUNSUKE (JP)
TANAKA SYUNSUKE (JP)
Application Number:
PCT/JP2023/019266
Publication Date:
February 15, 2024
Filing Date:
May 24, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
B05B7/16; C23C24/04; B05B12/20; C23C4/02
Domestic Patent References:
| WO2017057621A1 | 2017-04-06 | |||
| WO2021172483A1 | 2021-09-02 |
Foreign References:
| JP2020090710A | 2020-06-11 | |||
| JP2021109425A | 2021-08-02 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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