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Patent Searching and Data


Title:
MASTER SUBSTRATE AND METHOD OF MANUFACTURING A HIGH-DENSITY RELIEF STRUCTURE
Document Type and Number:
WIPO Patent Application WO2006043214
Kind Code:
A8
Abstract:
The present invention relates to a recording stack for obtaining a high-density relief structure, comprising: a first recording layer (10) on top of a second recording layer (12), the recording layers being supported by a substrate layer (14), wherein, upon projecting light on the recording layers, a local interaction of the recording layers leads to marks (16) on the basis of a local change of the properties with respect to chemical agents of the recording layers. The present invention further relates to a method of manufacturing a relief structure and a method of producing an optical data carrier.

Inventors:
MEINDERS ERWIN R (NL)
LOCH ROLF A (NL)
Application Number:
PCT/IB2005/053355
Publication Date:
July 27, 2006
Filing Date:
October 12, 2005
Export Citation:
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Assignee:
KONINKL PHILIPS ELECTRONICS NV (NL)
MEINDERS ERWIN R (NL)
LOCH ROLF A (NL)
International Classes:
G11B7/26
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