Title:
CU/CERAMIC MATERIAL JOINT, METHOD FOR MANUFACTURING CU/CERAMIC MATERIAL JOINT, AND SUBSTRATE FOR POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2015/046280
Kind Code:
A1
Abstract:
A Cu/ceramic material joint according to the present invention is produced by joining a copper member comprising copper or a copper alloy to a ceramic member comprising AlN or Al2O3 using a joint material containing Ag and Ti, wherein a Ti compound layer comprising a Ti nitride or a Ti oxide is formed at the joint interface between the copper member and the ceramic member, and Ag particles are dispersed in the Ti compound layer.
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Inventors:
TERASAKI NOBUYUKI (JP)
NAGATOMO YOSHIYUKI (JP)
NAGATOMO YOSHIYUKI (JP)
Application Number:
PCT/JP2014/075339
Publication Date:
April 02, 2015
Filing Date:
September 25, 2014
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C04B37/02; B32B15/04; B32B18/00; H01L23/12; H01L23/13; H01L23/36; H01L23/373; H01L25/07; H01L25/18
Foreign References:
| JPH05246769A | 1993-09-24 | |||
| JPH0648852A | 1994-02-22 | |||
| JPH0570260A | 1993-03-23 | |||
| JPH09283671A | 1997-10-31 | |||
| JPH03261669A | 1991-11-21 | |||
| JPS63257294A | 1988-10-25 | |||
| JPH04162756A | 1992-06-08 | |||
| JP3211856B2 | 2001-09-25 |
Other References:
See also references of EP 3053899A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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