Title:
MATERIAL FOR LOCATING GAS LEAK, METHOD FOR LOCATING GAS LEAK, MATERIAL FOR REPAIRING GAS LEAK, METHOD FOR REPAIRING GAS LEAK, AND DEVICE FOR REPAIRING GAS LEAK
Document Type and Number:
WIPO Patent Application WO/2021/192878
Kind Code:
A1
Abstract:
Provided is a material for locating gas leaks, which is for application to suspected gas leaks to locate a gas leak. If the viscosity of the material at 25°C and a shear rate of 0.1 s-1 is expressed by A (Pa·s) and the viscosity of the material at 25°C and a shear rate of 10 s-1 is expressed by B (Pa·s), then the relationship A/B≥21.0 is satisfied. The material, after having been cured, has a modulus E' at 50°C of 10 MPa or greater.
Inventors:
MORI YASUTAKA (JP)
KUBOTA TAKAAKI (JP)
ABE TETSUYA (JP)
KUBOTA TAKAAKI (JP)
ABE TETSUYA (JP)
Application Number:
PCT/JP2021/008327
Publication Date:
September 30, 2021
Filing Date:
March 04, 2021
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C08F20/12; F16L55/175; F16L55/18
Domestic Patent References:
| WO2019225283A1 | 2019-11-28 |
Foreign References:
| JP2019095032A | 2019-06-20 | |||
| JP2016038381A | 2016-03-22 | |||
| JP6571851B1 | 2019-09-04 | |||
| JP2011179552A | 2011-09-15 | |||
| JP2017089878A | 2017-05-25 |
Other References:
See also references of EP 4130061A4
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
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