Title:
MATERIAL FOR UNDERLAYER FILM FORMATION USE, RESIST UNDERLAYER FILM, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2020/162183
Kind Code:
A1
Abstract:
A material for underlayer film formation use, which contains at least one resin (preferably at least two resins) having (i) an elemental constitutional ratio Re defined by mathematical formula (1) of 1.5 to 2.8, (ii) a glass transition temperature of 30 to 250°C and (iii) a specific structural unit, and which can be used in a multi-layer resist process. In mathematical formula (1), NH represents the number of hydrogen atoms in a solid content of the material for underlayer film formation use, NC represents the number of carbon atoms in the solid content of the material for underlayer film formation use, and NO represents the number of oxygen atoms in the solid content of the material for underlayer film formation use.
Inventors:
INOUE KOJI (JP)
KAWASHIMA KEISUKE (JP)
FUJII KENICHI (JP)
ODA TAKASHI (JP)
KAWASHIMA KEISUKE (JP)
FUJII KENICHI (JP)
ODA TAKASHI (JP)
Application Number:
PCT/JP2020/002157
Publication Date:
August 13, 2020
Filing Date:
January 22, 2020
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
B32B27/06; B32B3/30; B32B7/027; C08G61/06; G03F7/11; G03F7/26; H01L21/027
Domestic Patent References:
| WO2017141612A1 | 2017-08-24 | |||
| WO2018221575A1 | 2018-12-06 | |||
| WO2013054702A1 | 2013-04-18 | |||
| WO2017183612A1 | 2017-10-26 | |||
| WO2009008446A1 | 2009-01-15 | |||
| WO2018221575A1 | 2018-12-06 | |||
| WO2017183612A1 | 2017-10-26 |
Foreign References:
| JP2017102420A | 2017-06-08 | |||
| JP2008026600A | 2008-02-07 | |||
| JP2014174428A | 2014-09-22 | |||
| JP2004177668A | 2004-06-24 | |||
| JP2019020570A | 2019-02-07 | |||
| JP2019165498A | 2019-09-26 |
Other References:
H. GOKANS. ESHOY. OHNISHI, J. ELECTROCHEM. SOC.: SOLID-STATE SCIENCE AND TECHNOLOGY, 1983, pages 143 - 146
SPIE, vol. 469, 1984
SPIE, vol. 469, 1984
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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