Title:
MEASUREMENT DEVICE, ADDITIVE MACHINING SYSTEM, AND CUTTING MACHINING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/017557
Kind Code:
A1
Abstract:
This measurement device (10) comprises: a sensor (12) for acquiring image information by imaging an object for which addition or cutting of a material is to be implemented; a measurement unit (13) for measuring the shape of the object on the basis of the image information, thereby acquiring measurement data indicating the shape of the object; a deficient region detection unit (15) for detecting a deficient region, which is a region on the object for which the measurement data is deficient; a measurement data supplementation unit (16) for re-measuring the shape of the object on the basis of image data acquired through an additional instance of imaging by the sensor (12), thereby acquiring re-measurement data pertaining to the deficient region, and supplementing the measurement data using the re-measurement data; and a machining region identification unit (17) for identifying, on the basis of the supplemented measurement data and a model of a completed component produced through addition or cutting, a machining region in which addition or cutting is to be implemented.
Inventors:
ASADA SHIGENOBU (JP)
Application Number:
PCT/JP2021/029486
Publication Date:
February 16, 2023
Filing Date:
August 10, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/34; B23Q17/24
Foreign References:
| JP2003311587A | 2003-11-05 | |||
| JP2003315028A | 2003-11-06 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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