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Title:
MEASUREMENT DEVICE AND METHOD FOR ESTIMATING MOUTHFEEL AND BEHAVIOR OF ALIMENTARY BOLUS DURING EATING AND SWALLOWING
Document Type and Number:
WIPO Patent Application WO/2017/026090
Kind Code:
A1
Abstract:
The present invention addresses the problem of developing a device with which it is possible to precisely and easily measure, evaluate, and quantify the dynamic properties of an alimentary bolus that simulates the swallowing of a wide variety of types of food products, and providing a method for estimating the mouthfeel from the dynamic properties by using the device. A measurement device for simulatively replicating a state of swallowing an alimentary bolus, and measuring the motion and shape of a specimen used as a simulative alimentary bolus, wherein the measurement device is provided with: a tilted plate having a tilted surface; a supply unit (a) for supplying a specimen onto the tilted surface; a supply sensor (c) for detecting the specimen supplied from the supply unit (a) onto the tilted surface; an arrival sensor (d, f) for detecting the specimen moving downward to a prescribed site on the tilted surface; a data logger (i) for recording the output from each of the sensors; an upper-surface camera (h) for imaging, from a position above the inclined surface, the specimen moving downward on the inclined surface, and generating an upper-surface image; a side-surface camera (g) for imaging, from a position to the side of the inclined surface, the specimen moving downward on the inclined surface, and generating a side-surface image; and a calculation unit for using at least one of the output from the data logger (i), the side-surface image, and the upper-surface image to calculate a state parameter that represents the state of the specimen moving downward on the inclined surface.

Inventors:
KAMIYA TETSU (JP)
JINNO NOBUKO (JP)
TAKAI MEGUMI (JP)
Application Number:
PCT/JP2016/003299
Publication Date:
February 16, 2017
Filing Date:
July 12, 2016
Export Citation:
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Assignee:
MEIJI CO LTD (JP)
International Classes:
G01N11/00; G01N33/02
Domestic Patent References:
WO2013002380A12013-01-03
Foreign References:
JP2013185903A2013-09-19
JP2006078477A2006-03-23
US8936471B22015-01-20
Other References:
See also references of EP 3333565A4
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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