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Patent Searching and Data


Title:
MEASUREMENT DEVICE, MEASUREMENT METHOD, AND MEASUREMENT PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/243578
Kind Code:
A1
Abstract:
The present invention corrects errors in measurement on the basis of the actual circumstances in which the measurement is done. A measurement device (1) is for measuring an electrical characteristic value of a measurement subject arranged in at least one measurement region, said device comprising: a storage unit (19) for storing, in association with measurement regions (101-110), offset amounts between a reference value for an electrical characteristic of a reference measurement subject (20S) that is a reference for a measurement subject (20) and electrical characteristic values of the reference measurement subject (20S) measured in the measurement regions (101-110); a measurement region information receiving unit (181) for receiving information identifying the actual measurement regions (101-110) for when the electrical characteristic values of the measurement subject (20) are being measured; an offset amount identification unit (182) for identifying offset amounts corresponding to the information identifying the measurement regions (101-110); a measurement unit (185) for measuring the electrical characteristic values of the measurement subject (20); and a correction unit (186) for correcting the electrical characteristic values of the measurement subject (20) in accordance with the identified offset amounts.

Inventors:
NAKAMURA TETSUYA (JP)
KITAMURA NAOYA (JP)
Application Number:
PCT/JP2023/021655
Publication Date:
December 21, 2023
Filing Date:
June 12, 2023
Export Citation:
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Assignee:
HIOKI ELECTRIC WORKS (JP)
International Classes:
G01R27/02; G01R31/389
Domestic Patent References:
WO2021153100A12021-08-05
WO2020149247A12020-07-23
Foreign References:
JPS5740949A1982-03-06
JPH02300627A1990-12-12
JP2011211060A2011-10-20
JP2009252976A2009-10-29
JPS6447960A1989-02-22
CN115118221A2022-09-27
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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