Title:
MEMBER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/044441
Kind Code:
A1
Abstract:
Provided is a member processing method capable of preventing damage, etc., to the workpiece while including detachment of a hard substrate from a workpiece (member, etc.). The member processing method of the present invention includes a lamination step for laminating a hard substrate, a UV-absorbing layer, and a workpiece in that order, followed by a processing step for processing the workpiece, followed by a detachment step for irradiating the UV-absorbing layer with UV rays to detach the hard substrate from the workpiece.
Inventors:
UENO SHUSAKU (JP)
HIRAYAMA TAKAMASA (JP)
HIRAYAMA TAKAMASA (JP)
Application Number:
PCT/JP2021/018010
Publication Date:
March 03, 2022
Filing Date:
May 12, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J5/00; C09J7/38; C09J11/06; C09J201/00; H01L21/02; H01L21/301; H01L21/304; H01L21/683
Foreign References:
| JP2018028001A | 2018-02-22 | |||
| JP2020035918A | 2020-03-05 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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