Title:
MEMS CHIP ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2021/168902
Kind Code:
A1
Abstract:
A MEMS chip assembly, said assembly comprising a substrate (20) and a MEMS chip (10) mounted on the substrate (20); the MEMS chip (10) comprises a base (1) having a cavity (3), and a sensing part (2) arranged on the base (1), and the MEMS chip (10) adheres to the substrate (20) by means of a liquid adhesive; the base (1) comprises inner walls (11) that surround and form the cavity (3), and the base (1) further comprises liquid adhesive stopping layers (12) that extend from the inner walls (11) into the cavity (3). The present invention can effectively stop a patch liquid adhesive from overflowing onto a top part of the MEMS chip (10), which prevents performance loss of the microphone caused by the liquid adhesive polluting a diaphragm (22). Additionally, the liquid adhesive stopping layers (12) can enlarge the bonding surface area of the liquid adhesive and a bottom part of the MEMS chip (10), further strengthening the connection of the MEMS chip (10) and the substrate (20), strengthening the ability of microphone components to withstand shaking and falling, and improving reliability.
Inventors:
BAI YANG (CN)
Application Number:
PCT/CN2020/078373
Publication Date:
September 02, 2021
Filing Date:
March 09, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/04; H04R19/00
Foreign References:
| CN208924505U | 2019-05-31 | |||
| CN206232397U | 2017-06-09 | |||
| CN209419845U | 2019-09-20 | |||
| CN206302570U | 2017-07-04 | |||
| CN103686570A | 2014-03-26 | |||
| CN206341427U | 2017-07-18 | |||
| US20100072561A1 | 2010-03-25 |
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY FIRM (CN)
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