Title:
MEMS DEVICE AND MEMS DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/225047
Kind Code:
A1
Abstract:
An MEMS device (1) comprises: a lower substrate (50) that includes a resonator (10); an upper substrate (30) provided so as to face an upper electrode (E2) of the resonator (10); a bonding layer (40) that seals the inner space between the lower substrate (50) and the upper substrate (30); and wiring layers (51A, 51B, 52A, 52B) containing the same metal material as the bonding layer (40). The rare gas content of the wiring layers (51A, 51B, 52A, 52B) is less than 1×1020 (atoms/cm3).
Inventors:
FUKUMITSU MASAKAZU (JP)
Application Number:
PCT/JP2018/047317
Publication Date:
November 28, 2019
Filing Date:
December 21, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/24; H01L23/08; H01L41/047; H01L41/053; H01L41/09; H01L41/29; H03H3/007
Domestic Patent References:
| WO2017090380A1 | 2017-06-01 | |||
| WO2016159018A1 | 2016-10-06 |
Foreign References:
| JPH10324966A | 1998-12-08 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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