MEMS MICROPHONE PACKAGE AND PACKAGING METHOD

Title:

MEMS MICROPHONE PACKAGE AND PACKAGING METHOD

Document Type and Number:

WIPO Patent Application WO/2011/062325

Kind Code:

A1

Abstract:

The present invention relates to a MEMS microphone package having improved acoustic properties, and to a packaging method, which involve adding a vent path in the packaging process to improve equilibrium between internal and external air pressure. The MEMS microphone package of the present invention comprises: a MEMS microphone chip having a back plate and a diaphragm formed on a silicon body using MEMS fabrication technology; a substrate on which the MEMS microphone chip is mounted; a bonded portion formed by applying an adhesive onto the substrate excluding one portion, and then bonding the MEMS microphone chip body to the substrate, so as to form a vent path between the MEMS microphone chip body and the substrate; and a case bonded to the substrate so as to define a space for housing the MEMS microphone chip. Equilibrium between internal and external air pressure of the MEMS microphone chip is achieved by means of the vent path, thereby improving acoustic properties.

Inventors:

SONG CHUNG-DAM (KR)
KIM CHANG-WON (KR)
KIM JUNG-MIN (KR)
LEE WON-TAEK (KR)
PARK SUNG-HO (KR)

Application Number:

PCT/KR2010/000877

Publication Date:

May 26, 2011

Filing Date:

February 11, 2010

Export Citation:

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Assignee:

BSE CO LTD (KR)
SONG CHUNG-DAM (KR)
KIM CHANG-WON (KR)
KIM JUNG-MIN (KR)
LEE WON-TAEK (KR)
PARK SUNG-HO (KR)

International Classes:

H04R19/04; H04R31/00

Foreign References:

JP2008271426A	2008-11-06
KR20090000180U	2009-01-08
JP2008244752A	2008-10-09
JP2008244627A	2008-10-09

Other References: