Title:
MEMS MICROPHONE
Document Type and Number:
WIPO Patent Application WO/2021/174587
Kind Code:
A1
Abstract:
Provided is a MEMS microphone. The MEMS microphone comprises a shell with an accommodating space, and a MEMS chip and an ASIC chip that are accommodated in the accommodating space. The shell comprises a substrate used for installing the MEMS chip and the ASIC chip, a first metal shell used for defining the accommodating space together with the substrate, and a second metal shell arranged outside the first metal shell in a sleeving manner at an interval. The second metal shell is fixed on the substrate and forms a first shell gap together with the substrate and the first metal shell, the substrate is provided with a pickup hole matching the MEMS chip, and the first metal shell is provided with a vent hole enabling the accommodating space to be in communication with the first shell gap. By arranging the second metal shell outside the first metal shell, expansion air in the shell gap can be transmitted into the accommodating space by means of the vent hole in a reflow soldering installation process and is guided out by means of the pickup hole, such that a situation where the second metal shell falls off due to expansion is avoided.
Inventors:
HU HENGBIN (CN)
WANG TIANJIAO (CN)
WANG TIANJIAO (CN)
Application Number:
PCT/CN2020/079623
Publication Date:
September 10, 2021
Filing Date:
March 17, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/04; H04R1/08
Foreign References:
| CN110868682A | 2020-03-06 | |||
| CN209402725U | 2019-09-17 | |||
| CN201571176U | 2010-09-01 | |||
| CN109641739A | 2019-04-16 | |||
| US20190014421A1 | 2019-01-10 |
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY FIRM (CN)
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