Title:
MEMS MICROPHONE
Document Type and Number:
WIPO Patent Application WO/2022/067945
Kind Code:
A1
Abstract:
The present invention provides an MEMS microphone, comprising a circuit board, a housing covering the circuit board to form an accommodation cavity, and an ASIC chip and an MEMS chip provided in the accommodation cavity; the circuit board, the ASIC chip and the MEMS chip are electrically connected to one another, the MEMS chip comprises a base having a back cavity, a back plate fixedly provided on one side of the base, and a diaphragm fixedly provided on the side of the back plate facing away from the base; the diaphragm comprises a vibrating portion directly facing the back cavity, and a fixing portion provided around the vibrating portion and fixed on the back plate; a ventilation hole penetrates through the vibrating portion, at least one of the circuit board and the housing is provided with a substrate provided with a sound input hole, the substrate is located on the side of the diaphragm facing away from the base, a support is sandwiched between the fixing portion and the substrate, the support is spaced apart from the ASIC chip, the support is provided with a front cavity achieving communication between the sound input hole and the ventilation hole, and the front cavity is in communication with the back cavity by means of the ventilation hole. Compared with the related art, the MEMS microphone of the present invention has a higher signal-to-noise ratio.
Inventors:
KERVRAN YANNICK (CN)
Application Number:
PCT/CN2020/125734
Publication Date:
April 07, 2022
Filing Date:
November 01, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/04; H04R1/08
Foreign References:
| CN112118522A | 2020-12-22 | |||
| CN110351642A | 2019-10-18 | |||
| CN108366330A | 2018-08-03 | |||
| CN104754481A | 2015-07-01 | |||
| CN210112275U | 2020-02-21 | |||
| US20190090048A1 | 2019-03-21 |
Attorney, Agent or Firm:
SHENZHEN ZICHEN INTELLECTUAL PROPERTY AGENCY LIMITED (CN)
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