Title:
MEMS SOUND SENSOR, MEMS MICROPHONE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/133312
Kind Code:
A1
Abstract:
A MEMS sound sensor, comprising: a substrate and a first sound sensing unit and a second sound sensing unit arranged on the substrate; the first sound sensing unit is used for detecting sound by means of at least one of air sound pressure change and mechanical vibration, and the first sound sensing unit comprises: a first back plate arranged above the substrate; a first diaphragm arranged opposite the first back plate, a gap being formed between same and the first back plate; the first diaphragm and the first back plate constitute a capacitive structure; and a first connecting column, a second end of the first connecting column being fixedly connected to the first back plate in order to secure and support the first diaphragm on the first back plate; at least one mass block is arranged on the edge area of the first diaphragm, a gap being formed between the mass block and the first back plate.
Inventors:
HO HSIEN-LUNG (CN)
HSIEH KUAN-HONG (CN)
CHIU SHIH-CHIA (CN)
HSIEH KUAN-HONG (CN)
CHIU SHIH-CHIA (CN)
Application Number:
PCT/CN2018/125215
Publication Date:
July 02, 2020
Filing Date:
December 29, 2018
Export Citation:
Assignee:
GETTOP ACOUSTIC CO LTD (CN)
International Classes:
H04R19/04
Foreign References:
| CN205283815U | 2016-06-01 | |||
| CN206962880U | 2018-02-02 | |||
| CN108513241A | 2018-09-07 | |||
| US20150256916A1 | 2015-09-10 | |||
| US20130126990A1 | 2013-05-23 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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