MESO-MICROELECTROMECHANICAL SYSTEM PACKAGE

Title:

MESO-MICROELECTROMECHANICAL SYSTEM PACKAGE

Document Type and Number:

WIPO Patent Application WO2004095508

Kind Code:

A3

Abstract:

A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

Inventors:

ELIACIN MANES
KLOSOWIAK TOMASZ
LEMPKOWSKI ROBERT
LIAN KE

Application Number:

PCT/US2003/040468

Publication Date:

May 06, 2005

Filing Date:

December 18, 2003

Export Citation:

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Assignee:

MOTOROLA INC (US)

International Classes:

B81B7/00; (IPC1-7): H01P1/10

Foreign References:

US6661084B1	2003-12-09
US6600712B1	2003-07-29
US6649852B2	2003-11-18

Other References: