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Title:
METAL BASE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/201119
Kind Code:
A1
Abstract:
A metal base substrate according to the present invention has a metal substrate, an insulating layer, and a circuit layer laminated in this order, wherein the insulating layer comprises an insulating resin and an inorganic filler, and the elastic modulus (unit: GPa) of the insulating layer at 100°C, the elastic modulus (unit: GPa) of the circuit layer at 100°C, the thickness (unit: μm) of the insulating layer, the thickness (unit: μm) of the circuit layer, and the thickness (unit: μm) of the metal substrate are set so as to satisfy a predetermined formula.

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Inventors:
ISHIKAWA FUMIAKI (JP)
HARA SHINTARO (JP)
Application Number:
PCT/JP2021/013892
Publication Date:
October 07, 2021
Filing Date:
March 31, 2021
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/14; H05K1/05
Domestic Patent References:
WO2004064467A12004-07-29
Foreign References:
JP2015043417A2015-03-05
JP2010287844A2010-12-24
JP2008218596A2008-09-18
JP2005353974A2005-12-22
JP2020065162A2020-04-23
JP2016111171A2016-06-20
Other References:
See also references of EP 4131362A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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