Title:
METAL-CLAD LAMINATE HAVING PROTECTED EDGE, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING INTERMEDIATE FOR PRINTED WIRING BOARDS
Document Type and Number:
WIPO Patent Application WO/2022/050360
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide a metal-clad laminate having protected edge, said metal-clad laminate being able to be suppressed in breaking of the edge and being able to be suppressed in the ingress of a strong alkaline solution into the edge in cases where the metal-clad laminate is exposed to the solution. Another purpose of the present invention is to provide: a method for producing a printed wiring board; and a method for producing an intermediate for printed wiring boards. The present invention provides a metal-clad laminate having protected edge, wherein the edge of the metal-clad laminate is covered with a protective material.
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Inventors:
UCHIDA NORIYUKI (JP)
WATANABE RYOICHI (JP)
WATANABE RYOICHI (JP)
Application Number:
PCT/JP2021/032338
Publication Date:
March 10, 2022
Filing Date:
September 02, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J11/08; B32B15/08; C09J7/38; C09J133/06; C09J153/02; H05K3/06; H05K3/26
Domestic Patent References:
| WO2006038547A1 | 2006-04-13 |
Foreign References:
| JP2009295620A | 2009-12-17 | |||
| JPH11154788A | 1999-06-08 | |||
| JP2013216853A | 2013-10-24 | |||
| JP2000234081A | 2000-08-29 | |||
| JP2009239215A | 2009-10-15 | |||
| JP2005197443A | 2005-07-21 | |||
| JPH05283832A | 1993-10-29 | |||
| JP2018113283A | 2018-07-19 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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