Title:
METAL-CLAD LAMINATE AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/196617
Kind Code:
A1
Abstract:
Provided are a metal-clad laminate for which various adhesive layer materials can be selected and in which transmission loss can be suppressed, and a wiring board using the same. The metal-clad laminate comprises a metal foil (1), an adhesive layer (2), and a core base material (3) in this order, and the thickness Ta of the adhesive layer, the dielectric loss tangent Dfa of the adhesive layer, and the dielectric loss tangent Dfc of the core base material satisfy the relationships shown in the following Equations 1 and 2, respectively, at a frequency of 28 GHz. Equation 1: Ta ≦ 0.0095 × (Dfa-Dfc) -1.235,
Equation 2: Dfa > Dfc
Inventors:
ONO MOTOSHI (JP)
MOTEGI TAKESHI (JP)
MOTEGI TAKESHI (JP)
Application Number:
PCT/JP2022/011237
Publication Date:
September 22, 2022
Filing Date:
March 14, 2022
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B15/08; H05K1/03; H05K1/09
Domestic Patent References:
| WO2020059606A1 | 2020-03-26 | |||
| WO2017077912A1 | 2017-05-11 |
Foreign References:
| JP2017149861A | 2017-08-31 | |||
| JP2019067929A | 2019-04-25 | |||
| JP2020096094A | 2020-06-18 | |||
| JP2016028885A | 2016-03-03 |
Other References:
HOSONO, RYOHEI.: "LCP-based Millimeter-wave devices. ", FUJIKURA TECHNICAL REVIEW., 31 July 2018 (2018-07-31), pages 1 - 5, XP055968433, [retrieved on 20221005]
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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