Title:
METAL-COATED RESIN PARTICLES AND ELECTROCONDUCTIVE ADHESIVE IN WHICH SAME ARE USED
Document Type and Number:
WIPO Patent Application WO/2015/162931
Kind Code:
A1
Abstract:
Provided are metal-coated resin particles that comprise resin particles and a metal coating layer that covers at least some of the resin particles, wherein it is possible to obtain a high-reliability electrical connection after repeated compression. There are used metal-coated resin particles that have an average grain diameter of 1-100 μm and exhibit a recovery of at least 90% after 30% compressive deformation, the metal coating layer comprising a metal having a Vickers hardness of 100 or less and an average thickness of 20-150 nm.
Inventors:
SOYODA MASAMI (JP)
TOTOUGE MASAYUKI (JP)
TERADA TSUNEHIKO (JP)
HORIUCHI SHIN (JP)
NAKAO YUKIMICHI (JP)
TOTOUGE MASAYUKI (JP)
TERADA TSUNEHIKO (JP)
HORIUCHI SHIN (JP)
NAKAO YUKIMICHI (JP)
Application Number:
PCT/JP2015/002210
Publication Date:
October 29, 2015
Filing Date:
April 23, 2015
Export Citation:
Assignee:
TATSUTA DENSEN KK (JP)
International Classes:
H01B5/00; C09J9/02; C09J11/08; C09J201/00; H01B1/00; H01B1/16; H01B1/22; H01B5/16; H01R11/01
Domestic Patent References:
WO2010013668A1 | 2010-02-04 | |||
WO2011001910A1 | 2011-01-06 |
Foreign References:
JP2005036265A | 2005-02-10 | |||
JP2012164484A | 2012-08-30 | |||
JP2004164874A | 2004-06-10 | |||
JP2013181131A | 2013-09-12 | |||
JPH11339558A | 1999-12-10 | |||
JP2006012709A | 2006-01-12 | |||
JP2008285631A | 2008-11-27 | |||
JP2011238433A | 2011-11-24 | |||
US5565143A | 1996-10-15 |
Attorney, Agent or Firm:
TSUTADA, Masato et al. (JP)
Masato Tsutada (JP)
Masato Tsutada (JP)
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